250mA to 1.5A, Adjustable

Current-Limit Switches

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Ω.

Note: Connecting any capacitance larger than 20pF to

SETI can cause instability.

IN Bypass Capacitor

Connect a minimum of 1µF capacitor from IN to GND to

limit the input voltage drop during momentary output

short-circuit conditions. Larger capacitor values further

reduce the voltage undershoot at the input.

OUT Bypass Capacitor

For stable operation over the full temperature range

and over the full-programmable current-limit range, use

a 1µF ceramic capacitor from OUT to ground.

Excessive output capacitance can cause a false over-

current condition due to decreased dv/dt across the

capacitor. Calculate the maximum capacitive load

following formula:

Layout and Thermal Dissipation

To optimize the switch response time to output short-

circuit conditions, it is very important to keep all traces

as short as possible to reduce the effect of undesirable

parasitic inductance. Place input and output capacitors

as close as possible to the device (no more than 5mm).

IN and OUT must be connected with wide short traces

to the power bus. During normal operation, the power

dissipation is small and the package temperature

change is minimal. If the output is continuously shorted

to ground at the maximum supply voltage, the opera-

tion of the switches with the autoretry option does not

cause problems because the total power dissipated

during the short is scaled by the duty cycle:

Attention must be given to the MAX14523C continuous

current-limit version when the power dissipation during

a fault condition can cause the device to reach the ther-

mal shutdown threshold.

Chip Information

PROCESS: BiCMOS

P

VI

t

tt

MAX

IN MAX

OUT MAX

BLANK

RETRY

BLA

()

()

()

=

××

+

N

NK

CµF

ImA

t

ms

VV

MAX

LIM

BLANK MIN

IN

()

()

(

)

()

()

=

×

TYPICAL CURRENT LIMIT/THRESHOLD (mA)

91.78

1500

121

1145

221

632

301

466

422

333

563.12

250

(Open)

0

Table 2. Current Limit/Threshold vs.

Resistor Values

PACKAGE TYPE

PACKAGE CODE

DOCUMENT NO.

8 TDFN-EP

T833+2

21-0137

Package Information

Pin Configuration

MAX14523A

MAX14523AL

MAX14523B

MAX14523C

1

+

TDFN

3mm x 3mm

N.C.

2

FLAG

3

SETI

4

OUT

8

GND

7

ON(ON)**

6

N.C.

5IN

*CONNECT EXPOSED PAD TO GND.

**( ) FOR THE MAX14523AL ONLY.

*EP