Electronic Components Datasheet Search |
|
QPI-12LZ-01 Datasheet(PDF) 4 Page - Vicor Corporation |
|
QPI-12LZ-01 Datasheet(HTML) 4 Page - Vicor Corporation |
4 / 4 page Picor Corporation • www.picorpower.com • QPI-12 Data Sheet Rev. 1.8 10/08 Vicor’s comprehensive line of power solutions includes high-density AC-DC & DC-DC modules and accessory components, fully configurable AC-DC & DC-DC power supplies, and complete custom power systems. Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for its use. No license is granted by implication or otherwise under any patent or patent rights of Vicor. Vicor components are not designed to be used in applications, such as life support systems, wherein a failure or malfunction could result in injury or death. All sales are subject to Vicor’s Terms and Conditions of Sale, which are available upon request. Specifications are subject to change without notice. Vicor Corporation 25 Frontage Road, Andover, MA, USA 01810 Tel: 800-735-6200 Fax: 978-475-6715 Email Sales Support: vicorexp@vicorpower.com Technical Support: apps@vicorpower.com QPI-12 PCB Layout Recommendations Figure 5 – Recommended mounting on a 2 layer board The filtering performance of the QPI-11 and –12 is sensitive to capacitive coupling between its input and output pins. Parasitic plane capacitance must be kept below 1 pico-Farad between inputs and outputs using the layout shown above and the recommendations described below to achieve maximum conducted EMI performance. To avoid capacitive coupling between input and output pins, there should not be any planes or large traces that run under both input and output pins, such as a ground plane or power plane. For example, if there are two signal planes or large traces where one trace runs under the input pins, and the other under the output pins, and both planes over lap in another area, they will cause capacitive coupling between input and output pins. Also, planes that run under both input and outputs pins, but do not cross, can cause capacitive coupling if they are capacitively by-passed together. Figure 5 shows the recommended pcb layout on a 2 layer board. Here, the top layer planes are duplicated on the bottom layer so that there can be no over- lapping of input and output planes. This method can be used for boards of greater layer count. Picor lidded QP SIPs are not hermetically sealed and must not be exposed to liquid, including but not limited to cleaning solvents, aqueous washing solutions or pressurized sprays. When soldering, it is recommended that no-clean flux solder be used, as this will insure that potentially corrosive mobile ions will not remain on, around, or under the module following the soldering process. For applications requiring water wash compatibility the “–01” open frame version should be used. Post Solder Cleaning |
Similar Part No. - QPI-12LZ-01 |
|
Similar Description - QPI-12LZ-01 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |