MAX2051ETP+T datasheet(2/16 Pages) MAXIM

Part #	MAX2051ETP+T

Description	SiGe, High-Linearity, 850MHz to 1550MHz Up/Downconversion Mixer with LO Buffer

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Manufacturer	MAXIM [Maxim Integrated Products]

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SiGe, High-Linearity, 850MHz to 1550MHz

Up/Downconversion Mixer with LO Buffer

2

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

DC ELECTRICAL CHARACTERISTICS

(

Typical Application Circuit, VCC = +4.75V to +5.25V, no input AC signals. TC = -40°C to +85°C, unless otherwise noted. Typical val-

ues are at VCC = +5.0V, TC = +25°C, unless otherwise noted.)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Note 1: Based on junction temperature TJ = TC + (

θJC x VCC x ICC). This formula can be used when the temperature of the exposed

pad is known while the device is soldered down to a PCB. See the

Applications Information section for details. The junction

temperature must not exceed +150°C.

Note 2: Junction temperature TJ = TA + (

θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is

known. The junction temperature must not exceed +150°C.

Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

Note 4: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.

VCC to GND ...........................................................-0.3V to +5.5V

RF, LO to GND.........................................................-0.3V to 0.3V

IF+, IF-, LOBIAS to GND ............................-0.3V to (VCC + 0.3V)

RF, LO Input Power ........................................................+20dBm

RF, LO Current (RF and LO is DC shorted to GND

through balun).................................................................50mA

Continuous Power Dissipation (Note 1) ........................2100mW

θJA (Notes 2, 3)..............................................................+33°C/W

θJC (Note 3)........................................................................8°C/W

Operating Case Temperature Range

(Note 4) ...................................................TC = -40°C to +85°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

VCC

4.75

5

5.25

V

Supply Current

ICC

Total supply current

105

130

mA

RECOMMENDED AC OPERATING CONDITIONS

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

RF Frequency

fRF

(Notes 5, 6)

850

1550

MHz

LO Frequency

fLO

(Note 5)

1200

2250

MHz

IF Frequency

fIF

Meeting RF and LO frequency ranges; IF

matching components affect the IF

frequency range (Note 5)

50

1000

MHz

LO Drive Level

PLO

-3

+9

dBm

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