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MAX2051ETP+T Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX2051ETP+T Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 16 page SiGe, High-Linearity, 850MHz to 1550MHz Up/Downconversion Mixer with LO Buffer 2 _______________________________________________________________________________________ ABSOLUTE MAXIMUM RATINGS DC ELECTRICAL CHARACTERISTICS ( Typical Application Circuit, VCC = +4.75V to +5.25V, no input AC signals. TC = -40°C to +85°C, unless otherwise noted. Typical val- ues are at VCC = +5.0V, TC = +25°C, unless otherwise noted.) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note 1: Based on junction temperature TJ = TC + ( θJC x VCC x ICC). This formula can be used when the temperature of the exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150°C. Note 2: Junction temperature TJ = TA + ( θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is known. The junction temperature must not exceed +150°C. Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Note 4: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB. VCC to GND ...........................................................-0.3V to +5.5V RF, LO to GND.........................................................-0.3V to 0.3V IF+, IF-, LOBIAS to GND ............................-0.3V to (VCC + 0.3V) RF, LO Input Power ........................................................+20dBm RF, LO Current (RF and LO is DC shorted to GND through balun).................................................................50mA Continuous Power Dissipation (Note 1) ........................2100mW θJA (Notes 2, 3)..............................................................+33°C/W θJC (Note 3)........................................................................8°C/W Operating Case Temperature Range (Note 4) ...................................................TC = -40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage VCC 4.75 5 5.25 V Supply Current ICC Total supply current 105 130 mA RECOMMENDED AC OPERATING CONDITIONS PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS RF Frequency fRF (Notes 5, 6) 850 1550 MHz LO Frequency fLO (Note 5) 1200 2250 MHz IF Frequency fIF Meeting RF and LO frequency ranges; IF matching components affect the IF frequency range (Note 5) 50 1000 MHz LO Drive Level PLO -3 +9 dBm |
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