MAX2031_09 datasheet(2/20 Pages) MAXIM

Part #	MAX2031

Description	High-Linearity, 650MHz to 1000MHz Upconversion/Downconversion Mixer with LO Buffer/Switch

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Manufacturer	MAXIM [Maxim Integrated Products]

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High-Linearity, 650MHz to 1000MHz Upconversion/

Downconversion Mixer with LO Buffer/Switch

2

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

VCC to GND ...........................................................-0.3V to +5.5V

RF (RF is DC shorted to GND through a balun)..................50mA

LO1, LO2 to GND ..................................................-0.3V to +0.3V

IF+, IF- to GND ...........................................-0.3V to (VCC + 0.3V)

TAP to GND ...........................................................-0.3V to +1.4V

LOSEL to GND ...........................................-0.3V to (VCC + 0.3V)

LOBIAS to GND..........................................-0.3V to (VCC + 0.3V)

RF, LO1, LO2 Input Power (Note 1) ...............................+20dBm

Continuous Power Dissipation (Note 2)....................................5W

θjA (Notes 3, 4)...............................................................+38°C/W

θjC (Notes 2, 3) ..............................................................+13°C/W

Operating Temperature Range (Note 5) .....TC = -40°C to +85°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

DC ELECTRICAL CHARACTERISTICS

(

Typical Application Circuit, VCC = 4.75V to 5.25V, no RF signals applied, TC = -40°C to +85°C. IF+ and IF- are DC grounded through an

IF balun. Typical values are at VCC = 5V, TC = +25°C, unless otherwise noted.)

RECOMMENDED AC OPERATING CONDITIONS

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

VCC

4.75

5.00

5.25

V

Supply Current

ICC

85

100

mA

LOSEL Input-Logic Low

VIL

0.8

V

LOSEL Input-Logic High

VIH

2V

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Components tuned for the 700MHz band

(Table 1), C1 = 7pF, C5 = 3.3pF (Notes 6, 7)

650

850

RF Frequency

fRF

Components tuned for the 800MHz/900MHz

cellular band (Table 1), C1 = 82pF,

C5 = 2.0pF (Note 6)

800

1000

MHz

LO Frequency

fLO

(Notes 6, 7)

650

1250

MHz

IF Frequency

fIF

IF frequency range depends on external IF

transformer selection

0

250

MHz

LO Drive Level

PLO

(Note 6)

-3

+3

dBm

Note 1: Maximum, reliable, continuous input power applied to the RF and IF port of this device is +12dBm from a 50

Ω source.

Note 2: Based on junction temperature TJ = TC + (

θJC x VCC x ICC). This formula can be used when the temperature of the exposed

pad is known while the device is soldered down to a PCB. See the

Applications Information section for details. The junction

temperature must not exceed +150°C.

Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

Note 4: Junction temperature TJ = TA + (

θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is

known. The junction temperature must not exceed +150°C.

Note 5: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.

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