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B048T120T30 Datasheet(PDF) 10 Page - Vicor Corporation |
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B048T120T30 Datasheet(HTML) 10 Page - Vicor Corporation |
10 / 12 page vicorpower.com 800-735-6200 V•I Chip Bus Converter Module B048F120T30 Rev. 2.5 Page 10 of 12 V•I Chip Bus Converter Module Parallel Operation The BCM will inherently current share when operated in an array. Arrays may be used for higher power or redundancy in an application. Current sharing accuracy is maximized when the source and load impedance presented to each BCM within an array are equal. The recommended method to achieve matched impedances is to dedicate common copper planes within the PCB to deliver and return the current to the array, rather than rely upon traces of varying lengths. In typical applications the current being delivered to the load is larger than that sourced from the input, allowing traces to be utilized on the input side if necessary. The use of dedicated power planes is, however, preferable. The BCM power train and control architecture allow bi-directional power transfer, including reverse power processing from the BCM output to its input. Reverse power transfer is enabled if the BCM input is within its operating range and the BCM is otherwise enabled. The BCM’s ability to process power in reverse improves the BCM transient response to an output load dump. Input Impedance Recommendations To take full advantage of the BCM capabilities, the impedance presented to its input terminals must be low from DC to approximately 5 MHz. The source should exhibit low inductance (less than 100 nH) and should have a critically damped response. If the interconnect inductance exceeds 100 nH, the BCM input pins should be bypassed with an RC damper (e.g., 47 µF in series with 0.3 ohm) to retain low source impedance and stable operations. Given the wide bandwidth of the BCM, the source response is generally the limiting factor in the overall system response. Anomalies in the response of the source will appear at the output of the BCM multiplied by its K factor. The DC resistance of the source should be kept as low as possible to minimize voltage deviations. This is especially important if the BCM is operated near low or high line as the over/under voltage detection circuitry could be activated. Input Fuse Recommendations V•I Chips are not internally fused in order to provide flexibility in configuring power systems. However, input line fusing of V•I Chips must always be incorporated within the power system. A fast acting fuse should be placed in series with the +In port. Application Notes For BCM and V•I Chip application notes on soldering, thermal management, board layout, and system design click on the link below: http://www.vicorpower.com/technical_library/application_information/chips/ Application Note |
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