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V•I Chip Bus Converter Module

B048F096T24

Rev. 4.5

Page 9 of 12

V•I Chip Bus Converter Module

Configuration Options

2.95±0.07

[0.116±0.003]

NON-PLATED

THROUGH HOLE

SEE NOTE 1.

ø

(2) PL

(4.37)

0.172

(11.37)

0.448

(7.00)

0.276

(36.50)

1.437

(18.25)

0.719

(2.510)

0.099

(31.48)

1.240

(39.50)

1.555

SEE NOTE 2.

DOTTED LINE

INDICATES VIC

POSITION

SEE NOTE 3

HEAT SINK PUSH-PIN HOLE PATTERN

( TOP SIDE SHOWN )

SEE NOTE 3

inch

(mm)

.

NOTES:

1. MAINTAIN 3.5/[0.138] DIA. KEEP OUT ZONE FREE OF

COPPER. ALL PCB LAYERS.

2. MINIMUM RECOMMENDED PITCH IS 39.50/[1.555].

THIS PROVIDES 7.00/[0.276] COMPONENT EDGE-TO-EDGE SPACING.

AND 0.50/[0.020] CLEARANCE BETWEEN VICOR HEAT SINKS.

3. V•I CHIP LAND PATTERN SHOWN FOR REFERENCE ONLY;

ACTUAL LAND PATTERN MAY DIFFER.

DIMENSIONS FROM EDGES OF LAND PATTERN TO PUSH-PIN

HOLES WILL BE THE SAME FOR ALL FULL SIZE V•I CHIPS.

4. DIMENSION ARE