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WBC-T0303CRGG-01-2004-KD Datasheet(PDF) 1 Page - IRC - a TT electronics Company. |
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WBC-T0303CRGG-01-2004-KD Datasheet(HTML) 1 Page - IRC - a TT electronics Company. |
1 / 3 page IRC Advanced Film Division General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of TT electronics plc • Corpus Christi Texas 78411 USA © IRC Advanced Film Division Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com WBC-CR Series Issue April 2006 Wire Bondable High Range Chip Resistors • New CHROMAXXTM film system • Discrete or tapped schematics • MIL inspection available • High resistor density WBC-CR Series IRC’s WBC-CR series now brings higher ohmic range thin film capabilities to hybrid applications. Using IRC’s new CHROMAXXTM film system on silicon substrates provides thin film performance on an extremely small footprint. Custom resistance values, sizes and schematics are available on request from the factory. Absolute Tolerance to ±0.1% Absolute TCR to ±100ppm/°C Package Power Rating (@ 70°C) 250mW Rated Operating Voltage (not to exceed P x R ) 100V Operating Temperature -55°C to +150°C Noise <-30dB Substrate Material Oxidized Silicon (10KÅ SiO 2 min) Substrate Thickness 0.010˝ ±0.001 (0.254mm ±0.025) Bond Pad Metallization Aluminum 10KÅ minimum Gold 15KÅ minimum Backside R0202 and T0303 Silicon (Gold available) B0202 Gold 3KÅ minimum Passivation Silicon Dioxide or Silicon Nitride √ (not to exceed P x R ) (not to exceed P x R ) √ Electrical Data 0.020˝ ±0.001 (0.508mm ±0.025) 0.020˝ ±0.001 (0.508mm ±0.025) 0.030˝ ±0.001 (0.762mm ±0.025) 0.004˝ min bond pad size 0.004˝ min bond pad size Back contact Top contact Physical Data R0202 - Discrete T0303 - Tapped network ½R + ½R B0202 - Discrete back contact Top contact pad chamfered R R ½R ½R 0.004˝ min bond pad size |
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