General Note

IRC reserves the right to make changes in product specification without notice or liability.

All information is subject to IRC’s own data and is considered accurate at time of going to print.

A subsidiary of

TT electronics plc

© IRC Advanced Film Division

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com

• 4222 South Staples Street • Corpus Christi Texas 78411 USA

Wire Bondable

Multi-tap Chip Resistors

WBC Series

Physical Data

Absolute Tolerance

to ±5%

Absolute TCR

to ±25ppm/°C

Package Power Rating

(@ 70°C)

250mW

Rated Operating Voltage

(not to exceed

P x R )

100V

Operating Temperature

-55°C to +150°C

Noise

<-30dB

Substrate Material

Oxidized Silicon

(10KÅ SiO

Substrate Thickness

0.010˝ ±0.001

(0.254mm ±0.025)

Bond Pad

Metallization

Aluminum

10KÅ minimum

Gold

15KÅ minimum

Backside

Silicon (gold available)

Passivation

Silicon Dioxide or

Silicon Nitride

Electrical Data

0.004˝ min Bond Pads

0.032˝ ±0.001

(0.813mm ±0.025)

Pad 1 chamfered

R

R

R

R

5R

5R

5R

5R

5R

R

5R

R

1

13

5R

Pad 13

√

WBC Series Issue January 2009 Sheet 1 of 3