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CY7C1526JV18-300BZXC Datasheet(PDF) 1 Page - Cypress Semiconductor

Part # CY7C1526JV18-300BZXC
Description  72-Mbit QDR-II SRAM 4-Word Burst Architecture
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C1526JV18-300BZXC Datasheet(HTML) 1 Page - Cypress Semiconductor

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72-Mbit QDR™-II SRAM 4-Word
Burst Architecture
CY7C1511JV18, CY7C1526JV18
CY7C1513JV18, CY7C1515JV18
Cypress Semiconductor Corporation
198 Champion Court
San Jose
, CA 95134-1709
408-943-2600
Document Number: 001-12560 Rev. *E
Revised July 31, 2009
Features
Separate independent read and write data ports
Supports concurrent transactions
300 MHz clock for high bandwidth
4-word burst for reducing address bus frequency
Double Data Rate (DDR) interfaces on both read and write ports
(data transferred at 600 MHz) at 300 MHz
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
Echo clocks (CQ and CQ) simplify data capture in high speed
systems
Single multiplexed address input bus latches address inputs
for read and write ports
Separate port selects for depth expansion
Synchronous internally self-timed writes
QDR-II operates with 1.5 cycle read latency when the Delay
Lock Loop (DLL) is enabled
Operates similar to a QDR-I device with 1 cycle read latency
in DLL off mode
Available in x8, x9, x18, and x36 configurations
Full data coherency, providing most current data
Core VDD = 1.8 (± 0.1V); IO VDDQ = 1.4V to VDD
Available in 165-ball FBGA package (15 x 17 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
Variable drive HSTL output buffers
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Configurations
CY7C1511JV18 – 8M x 8
CY7C1526JV18 – 8M x 9
CY7C1513JV18 – 4M x 18
CY7C1515JV18 – 2M x 36
Functional Description
The CY7C1511JV18, CY7C1526JV18, CY7C1513JV18, and
CY7C1515JV18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR-II architecture. QDR-II architecture consists
of two separate ports: the read port and the write port to access
the memory array. The read port has dedicated data outputs to
support read operations and the write port has dedicated data
inputs to support write operations. QDR-II architecture has
separate data inputs and data outputs to completely eliminate
the need to “turn-around” the data bus that exists with common
IO devices. Each port is accessed through a common address
bus. Addresses for read and write addresses are latched on
alternate rising edges of the input (K) clock. Accesses to the
QDR-II read and write ports are completely independent of one
another. To maximize data throughput, both read and write ports
are equipped with DDR interfaces. Each address location is
associated with four 8-bit words (CY7C1511JV18), 9-bit words
(CY7C1526JV18), 18-bit words (CY7C1513JV18), or 36-bit
words (CY7C1515JV18) that burst sequentially into or out of the
device. Because data is transferred into and out of the device on
every rising edge of both input clocks (K and K and C and C),
memory bandwidth is maximized while simplifying system
design by eliminating bus “turn-arounds”.
Depth expansion is accomplished with port selects, which
enables each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
Selection Guide
Description
300 MHz
250 MHz
167 MHz
Unit
Maximum Operating Frequency
300
250
167
MHz
Maximum Operating Current
x8
1090
790
570
mA
x9
1090
795
575
x18
1115
865
615
x36
1140
1040
725
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