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CY7C1473BV33-133AXC Datasheet(PDF) 1 Page - Cypress Semiconductor

Part # CY7C1473BV33-133AXC
Description  72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL Architecture
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C1473BV33-133AXC Datasheet(HTML) 1 Page - Cypress Semiconductor

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CY7C1471BV33
CY7C1473BV33, CY7C1475BV33
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through
SRAM with NoBL™ Architecture
Cypress Semiconductor Corporation
198 Champion Court
San Jose
, CA 95134-1709
408-943-2600
Document #: 001-15029 Rev. *B
Revised March 05, 2008
Features
No Bus Latency™ (NoBL™) architecture eliminates dead
cycles between write and read cycles
Supports up to 133 MHz bus operations with zero wait states
Data is transferred on every clock
Pin compatible and functionally equivalent to ZBT™ devices
Internally self timed output buffer control to eliminate the need
to use OE
Registered inputs for flow through operation
Byte Write capability
3.3V/2.5V IO supply (VDDQ)
Fast clock-to-output times
6.5 ns (for 133 MHz device)
Clock Enable (CEN) pin to enable clock and suspend operation
Synchronous self-timed writes
Asynchronous Output Enable (OE)
CY7C1471BV33, CY7C1473BV33 available in
JEDEC-standard Pb-free 100-pin TQFP, Pb-free and
non-Pb-free 165-Ball FBGA package. CY7C1475BV33
available in Pb-free and non-Pb-free 209-Ball FBGA package
Three Chip Enables (CE1, CE2, CE3) for simple depth
expansion
Automatic power down feature available using ZZ mode or CE
deselect
IEEE 1149.1 JTAG Boundary Scan compatible
Burst Capability—linear or interleaved burst order
Low standby power
Functional Description
The CY7C1471BV33, CY7C1473BV33, and CY7C1475BV33
are 3.3V, 2M x 36/4M x 18/1M x 72 synchronous flow through
burst SRAMs designed specifically to support unlimited true
back-to-back read or write operations without the insertion of
wait
states.
The
CY7C1471BV33,
CY7C1473BV33,
and
CY7C1475BV33 are equipped with the advanced No Bus
Latency (NoBL) logic. NoBL™ is required to enable consecutive
read or write operations with data being transferred on every
clock cycle. This feature dramatically improves the throughput of
data through the SRAM, especially in systems that require
frequent write-read transitions.
All synchronous inputs pass through input registers controlled by
the rising edge of the clock. The clock input is qualified by the
Clock Enable (CEN) signal, which when deasserted suspends
operation and extends the previous clock cycle. Maximum
access delay from the clock rise is 6.5 ns (133 MHz device).
Write operations are controlled by two or four Byte Write Select
(BWX) and a Write Enable (WE) input. All writes are conducted
with on-chip synchronous self timed write circuitry.
Three synchronous Chip Enables (CE1, CE2, CE3) and an
asynchronous Output Enable (OE) provide for easy bank
selection and output tri-state control. To avoid bus contention,
the output drivers are synchronously tri-stated during the data
portion of a write sequence. For best practice recommendations,
refer to the Cypress application note AN1064 “SRAM System
Guidelines”.
Selection Guide
Description
133 MHz
117 MHz
Unit
Maximum Access Time
6.5
8.5
ns
Maximum Operating Current
305
275
mA
Maximum CMOS Standby Current
120
120
mA
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