CY7C1024DV33
Document Number: 001-08353 Rev. *C
Page 3 of 9
Maximum Ratings
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Storage Temperature ................................. –65
°C to +150°C
Ambient Temperature with
Power Applied ............................................ –55
°C to +125°C
Supply Voltage on VCC Relative to GND
[2] ....–0.5V to +4.6V
DC Voltage Applied to Outputs
in High Z State [2]................................... –0.5V to VCC + 0.5V
DC Input Voltage [2] ............................... –0.5V to VCC + 0.5V
Current into Outputs (LOW) ........................................ 20 mA
Static Discharge Voltage............. ...............................>2001V
(MIL-STD-883, Method 3015)
Latch Up Current ..................................................... >200 mA
Operating Range
Range
Ambient
Temperature
VCC
Industrial
–40
°C to +85°C3.3V ± 0.3V
DC Electrical Characteristics
Over the Operating Range
Parameter
Description
Test Conditions [3]
–10
Unit
Min
Max
VOH
Output HIGH Voltage
VCC = Min, IOH = –4.0 mA
2.4
V
VOL
Output LOW Voltage
VCC = Min, IOL = 8.0 mA
0.4
V
VIH
Input HIGH Voltage
2.0
VCC + 0.3
V
VIL
[2]
Input LOW Voltage
–0.3
0.8
V
IIX
Input Leakage Current
GND < VI < VCC
–1
+1
μA
IOZ
Output Leakage Current
GND < VOUT < VCC, output disabled
–1
+1
μA
ICC
VCC Operating Supply
Current
VCC = Max, f = fMAX = 1/tRC
IOUT = 0 mA CMOS levels
175
mA
ISB1
Automatic CE Power Down
Current —TTL Inputs
Max VCC, CE > VIH
VIN > VIH or VIN < VIL, f = fMAX
30
mA
ISB2
Automatic CE Power Down
Current — CMOS Inputs
Max VCC, CE > VCC – 0.3V,
VIN > VCC – 0.3V, or VIN < 0.3V, f = 0
25
mA
Capacitance
Tested initially and after any design or process changes that may affect these parameters.
Parameter
Description
Test Conditions
Max
Unit
CIN
Input Capacitance
TA = 25°C, f = 1 MHz, VCC = 3.3V
8
pF
COUT
I/O Capacitance
10
pF
Thermal Resistance
Tested initially and after any design or process changes that may affect these parameters.
Parameter
Description
Test Conditions
119-Ball
PBGA
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Still air, soldered on a 3 × 4.5 inch,
four layer printed circuit board
20.31
°C/W
Θ
JC
Thermal Resistance
(Junction to Case)
8.35
°C/W
Notes
2. VIL (min) = –2.0V and VIH(max) = VCC + 2V for pulse durations of less than 20 ns.
3. CE refers to a combination of CE1, CE2, and CE3. CE is LOW when CE1, CE3 are LOW and CE2 is HIGH. CE is HIGH when CE1 is HIGH, or CE2 is LOW, or CE3 is HIGH.
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