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CXG1188UR Datasheet(PDF) 4 Page - Sony Corporation |
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CXG1188UR Datasheet(HTML) 4 Page - Sony Corporation |
4 / 4 page CXG1188UR - 4 - Sony Corporation Package Outline (Unit: mm) PIN 1 INDEX C 0.1 S A-B 0.4 0.05 M S C C A-B S 0.05 S + 0.09 12PIN UQFN PLASTIC 0.25 – 0.03 + 0.09 0.14 – 0.03 x 4 2.0 4 1 3 9 7 6 12 10 S 0.4 ± 0.1 0.6 0.55 ± 0.05 4-R0.2 A B 0.25 0.07 0.18 SONY CODE EIAJ CODE JEDEC CODE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.01g PACKAGE STRUCTURE UQFN-12P-01 PACKAGE MASS TERMINAL SECTION Note:Cutting burr of lead are 0.05mm MAX. Solder Plating Thermal Die Pad LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL COPPER ALLOY SOLDER COMPOSITION Sn-Bi Bi:1-4wt% PLATING THICKNESS 5-18µm SPEC. |
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Similar Description - CXG1188UR |
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