Electrical Characteristics

MC9S08SE8 Series MCU Data Sheet, Rev. 3

Freescale Semiconductor

7

3.3

Thermal Characteristics

This section provides information about operating temperature range, power dissipation, and package

thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in

on-chip logic and voltage regulator circuits, and it is user-determined rather than being controlled by the

Table 3. Absolute Maximum Ratings

Rating

Symbol

Value

Unit

Supply voltage

–0.3 to 5.8

V

120

mA

Digital input voltage

V

Instantaneous maximum current

1

Input must be current limited to the value specified. To determine the value of the required

voltages, then use the larger of the two resistance values.

current. This will be the greatest risk when the MCU is not consuming power. Examples are: if

no system clock is present, or if the clock rate is very low (which would reduce overall power

consumption).

±25

mA

Storage temperature range

–55 to 150

°C

Table 4. Thermal Characteristics

Rating

Symbol

Value

Unit

Operating temperature range (packaged)

C

V

M

–40 to 85

–40 to 105

–40 to 125

°C

Maximum junction temperature

135

°C

Thermal resistance

single-layer board

28-pin SOIC

θ

JA

70

°C/W

28-pin PDIP

68

16-pin TSSOP

129

Thermal resistance four-layer

board

28-pin SOIC

48

°C/W

28-pin PDIP

49

16-pin TSSOP

85