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MMC031050R250D13 Datasheet(PDF) 1 Page - IRC - a TT electronics Company.

Part # MMC031050R250D13
Description  Metal Glaze General Purpose Surface Mount Power Resistor
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Manufacturer  IRCTT [IRC - a TT electronics Company.]
Direct Link  http://www.irctt.com
Logo IRCTT - IRC - a TT electronics Company.

MMC031050R250D13 Datasheet(HTML) 1 Page - IRC - a TT electronics Company.

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General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Wire and Film Technologies Division
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
Metal GlazeGeneral Purpose
Surface Mount Power Resistor
MM Series
Up to 2 watts
Up to 1000 volts
0.1 ohm to 2.2 megohm range
150°C maximum operating temperature
Electrical Data
Size
Code
Industry
Footprint
IRC
Type
Maximum
Power
Rating
Working
Voltage²
Resistance
Range
(ohms)
Tolerance
(+%)³
TCR
(ppm/°C)³
Product
Category
B
1206
MMA0204
1/2
400
0.1 to 0.99
1, 2, 5
100
Low Range
1.0 to 1.0M
1, 2, 5
50, 100
Standard
20 to 348K
0.25, 0.5
50, 100
Tight Tolerance
F
2512
MMB0207
1
700
0.1 to 0.99
1, 2, 5
100
Low Range
1.0 to 2.21M
1, 2, 5
50, 100
Standard
20 to 348K
0.25, 0.5
50, 100
Tight Tolerance
H
3610
MMC0310
2
1000
0.1 to 0.99
1, 2, 5
100
Low Range
1.0 to 2.21M
1, 2, 5
50, 100
Standard
¹Not to exceed
P x R ²Consult factory for tighter TCR, tolerance, or resistance values.
Environmental Data
Characteristics
Maximum Change
Test Method
Temperature Coefficient
As specified
MIL-R-55342E Par 4.7.9 (-55°C +125°C)
Thermal Shock
±0.5% +0.01
Ω
MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles)
Low Temperature Operation
±0.25% +0.01
Ω
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
Short Time Overload
±0.5% +0.01
Ω
±1% for R>100K
Ω
MIL-R-55342E Par 4.7.5
2.5 x
P x R for 5 seconds
High Temperature Exposure
±0.5% +0.01
Ω
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
Resistance to Bonding Exposure
±0.25% +0.01
Ω
MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds)
Solderability
95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds)
Moisture Resistance
±0.5% +0.01
Ω
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
Life Test
±0.5% +0.01
Ω
MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent)
Terminal Adhesion Strength
±1% +0.01
Ω
no mechanical damage
1200 gram push from underside of mounted chip for
60 seconds
Resistance to Board Bending
±0.5% +0.01
Ω
no mechanical damage
Chip mounted in center of 90mm long board, deflected 5mm
so as to exert pull on chip contacts for 10 seconds
Metal Glaze™ thick
film element fired
at 1000°C to solid
ceramic substrate
High
temperature
dielectric
coating
60/40 Solder
over nickel barrier
MM Series Issue March 2009 Sheet 1 of 3


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