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TMS320C28343ZHHT Datasheet(PDF) 3 Page - Texas Instruments |
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TMS320C28343ZHHT Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 153 page  TMS320C28346, TMS320C28345, TMS320C28344 TMS320C28343, TMS320C28342, TMS320C28341 Delfino Microcontrollers www.ti.com SPRS516 – MARCH 2009 4.8 Enhanced Controller Area Network (eCAN) Modules (eCAN-A and eCAN-B) ..................................... 73 4.9 Serial Communications Interface (SCI) Modules (SCI-A, SCI-B, SCI-C) ........................................... 78 4.10 Serial Peripheral Interface (SPI) Module (SPI-A, SPI-D) ............................................................. 81 4.11 Inter-Integrated Circuit (I2C) .............................................................................................. 84 4.12 GPIO MUX .................................................................................................................. 85 4.13 External Interface (XINTF) ................................................................................................ 92 5 Device Support .................................................................................................................. 94 5.1 Device and Development Support Tool Nomenclature ................................................................ 94 5.2 Documentation Support ................................................................................................... 96 6 Electrical Specifications .................................................................................................... 100 6.1 Absolute Maximum Ratings ............................................................................................. 100 6.2 Recommended Operating Conditions .................................................................................. 101 6.3 Electrical Characteristics ................................................................................................ 101 6.4 Current Consumption ..................................................................................................... 102 6.4.1 Reducing Current Consumption ............................................................................. 103 6.5 Thermal Design Considerations ........................................................................................ 105 6.6 Emulator Connection Without Signal Buffering for the MCU ........................................................ 105 6.7 Timing Parameter Symbology ........................................................................................... 106 6.7.1 General Notes on Timing Parameters ....................................................................... 106 6.7.2 Test Load Circuit .............................................................................................. 106 6.7.3 Device Clock Table ........................................................................................... 107 6.8 Clock Requirements and Characteristics ............................................................................. 108 6.9 Power Sequencing ........................................................................................................ 109 6.9.1 Power Management and Supervisory Circuit Solutions ................................................... 109 6.10 General-Purpose Input/Output (GPIO) ................................................................................. 112 6.10.1 GPIO - Output Timing ......................................................................................... 112 6.10.2 GPIO - Input Timing ........................................................................................... 113 6.10.3 Sampling Window Width for Input Signals .................................................................. 114 6.10.4 Low-Power Mode Wakeup Timing ........................................................................... 115 6.11 Enhanced Control Peripherals .......................................................................................... 118 6.11.1 Enhanced Pulse Width Modulator (ePWM) Timing ........................................................ 118 6.11.2 Trip-Zone Input Timing ........................................................................................ 118 6.12 External Interrupt Timing ................................................................................................. 120 6.13 I2C Electrical Specification and Timing ................................................................................ 121 6.14 Serial Peripheral Interface (SPI) Timing ............................................................................... 121 6.14.1 Master Mode Timing ........................................................................................... 121 6.14.2 SPI Slave Mode Timing ....................................................................................... 125 6.15 External Interface (XINTF) Timing ...................................................................................... 127 6.15.1 USEREADY = 0 ................................................................................................ 128 6.15.2 Synchronous Mode (USEREADY = 1, READYMODE = 0) .............................................. 128 6.15.3 Asynchronous Mode (USEREADY = 1, READYMODE = 1) ............................................. 129 6.15.4 XINTF Signal Alignment to XCLKOUT ...................................................................... 130 6.15.5 External Interface Read Timing .............................................................................. 131 6.15.6 External Interface Write Timing .............................................................................. 132 6.15.7 External Interface Ready-on-Read Timing With One External Wait State ............................. 134 6.15.8 External Interface Ready-on-Write Timing With One External Wait State .............................. 137 6.15.9 XHOLD and XHOLDA Timing ................................................................................ 140 6.16 Multichannel Buffered Serial Port (McBSP) Timing .................................................................. 142 6.16.1 McBSP Transmit and Receive Timing ...................................................................... 142 6.16.2 McBSP as SPI Master or Slave Timing ..................................................................... 145 7 Thermal/Mechanical Data ................................................................................................... 149 Contents 3 |
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