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SN75DP139 Datasheet(PDF) 9 Page - Texas Instruments |
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SN75DP139 Datasheet(HTML) 9 Page - Texas Instruments |
9 / 32 page ABSOLUTE MAXIMUM RATINGS DISSIPATION RATINGS SN75DP139 www.ti.com...................................................................................................................................................................................................... SLLS977 – APRIL 2009 ORDERING INFORMATION(1) PART NUMBER PART MARKING PACKAGE SN75DP139RGZR DP139 48-pin QFN Reel (large) SN75DP139RGZT DP139 48-pin QFN Reel (small) (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT Supply voltage range(2) VCC –0.3 to 3.6 V Main Link Input (IN_Dx) differential voltage 1.56 V TMDS Outputs (OUT_Dx) –0.3 to 4 V HPD I/O (HPD_SOURCE, HPD_SINK) –0.3 to 5.5 V Voltage range Auxiliary I/O (SCL_SOURCE, SDA_SOURCE, SCL_SINK, –0.3 to 5.5 V SDA_SINK) Control I/O (OE_N, DDC_EN, SRC, OVS, HPDINV) –0.3 to 5.5 V Human body model(3) ±10000 V Electrostatic discharge Charged-device model(4) ±1500 V Machine model(5) ±200 V Continuous power dissipation See Dissipation Rating Table (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential voltages, are with respect to network ground terminal. (3) Tested in accordance with JEDEC Standard 22, Test Method A114-B (4) Tested in accordance with JEDEC Standard 22, Test Method C101-A (5) Tested in accordance with JEDEC Standard 22, Test Method A115-A PACKAGE PCB JEDEC TA ≤ 25°C DERATING FACTOR(1) TA = 85°C STANDARD ABOVE TA = 25°C POWER RATING Low-K 1426.8 mW 14.28 mW/°C 570 mW 48-pin QFN (RGZ) High-K 3125 mW 31.25 mW/°C 1250 mW (1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow. Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Link(s): SN75DP139 |
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