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BQ24074RGTTG4 Datasheet(PDF) 3 Page - Texas Instruments |
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BQ24074RGTTG4 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 39 page ABSOLUTE MAXIMUM RATINGS (1) DISSIPATION RATINGS RECOMMENDED OPERATING CONDITIONS bq24072, bq24073 bq24074, bq24075, bq24079 www.ti.com................................................................................................................................................. SLUS810D – SEPTEMBER 2008 – REVISED JUNE 2009 over the 0°C to 125°C operating free-air temperature range (unless otherwise noted) VALUE UNIT IN (with respect to VSS) –0.3 to 28 V BAT (with respect to VSS) –0.3 to 5 V VI Input Voltage OUT, EN1, EN2, CE, TS, ISET, PGOOD, CHG, ILIM, TMR, ITERM, –0.3 to 7 V SYSOFF, TD (with respect to VSS) II Input Current IN 1.6 A OUT 5 A Output Current IO BAT (Discharge mode) 5 A (Continuous) BAT (Charging mode) 1.5(2) A Output Sink Current CHG, PGOOD 15 mA TJ Junction temperature –40 to 150 °C Tstg Storage temperature –65 to 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to the network ground terminal unless otherwise noted. (2) The IC operational charging life is reduced to 20,000 hours, when charging at 1.5A and 125°C. The thermal regulation feature reduces charge current if the IC’s junction temperature reaches 125°C; thus without a good thermal design the maximum programmed charge current may not be reached. POWER RATING PACKAGE(1) RθJA RθJC TA ≤ 25°C TA = 85°C RGT (2) 39.47 °C/W 2.4 °C/W 2.3 W 225mW (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. (2) This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. The pad is connected to the ground plane by a 2x3 via matrix. MIN MAX UNIT IN voltage range 4.35 26 V VI ’72, ’73, ‘75, '79 4.35 6.4 IN operating voltage range V ‘74 4.35 10.2 IIN Input current, IN pin 1.5 A IOUT Current, OUT pin 4.5 A IBAT Current, BAT pin (Discharging) 4.5 A ICHG Current, BAT pin (Charging) 1.5(1) A TJ Junction Temperature –40 125 °C RILIM Maximum input current programming resistor 1100 8000 Ω RISET Fast-charge current programming resistor (2) 590 3000 Ω RITERM Termination current programming resistor 0 15 k Ω RTMR Timer programming resistor 18 72 k Ω (1) The IC operational charging life is reduced to 20,000 hours, when charging at 1.5A and 125°C. The thermal regulation feature reduces charge current if the IC’s junction temperature reaches 125°C; thus without a good thermal design the maximum programmed charge current may not be reached. (2) Use a 1% tolerance resistor for RISET to avoid issues with the RISET short test when using the maximum charge current setting. Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): bq24072 bq24073 bq24074 bq24075, bq24079 |
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