ZXMP6A17K

Document Revision: 2

2 of 8

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July 2009

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ZXMP6A17K

Characteristic

Symbol

Value

Unit

Drain-Source voltage

-60

V

Gate-Source voltage

±20

V

Continuous Drain current

(Note 3)

6.6

A

5.3

(Note 2)

4.4

Pulsed Drain current

(Note 4)

20.3

A

Continuous Source current (Body diode)

(Note 3)

9.3

A

Pulsed Source current (Body diode)

(Note 4)

20.3

A

Characteristic

Symbol

Value

Unit

Power dissipation

Linear derating factor

(Note 2)

4.17

33.3

W

mW/

°C

(Note 3)

9.25

74.0

(Note 5)

2.11

16.8

Thermal Resistance, Junction to Ambient

(Note 2)

30.0

°C/W

(Note 3)

13.5

(Note 5)

59.1

Thermal Resistance, Junction to Lead

(Note 6)

2.41

Operating and storage temperature range

-55 to 150

°C

Notes:

2. For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions; the device is

measured when operating in a steady-state condition.

3. Same as note 2, except the device is measured at t

≤ 10 sec.

4. Same as note 2, except the device is pulsed with D = 0.02 and pulse width 300 µs. The pulse current is limited by the maximum junction temperature.

5. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is

measured when operating in a steady-state condition.

6. Thermal resistance from junction to solder-point (at the end of the drain lead).