TPS6734I

FIXED 12-V 120-mA BOOST-CONVERTER SUPPLY

SLVS127A – AUGUST 1995 – REVISED JANUARY 1999

2

POST OFFICE BOX 655303

AVAILABLE OPTIONS

PACKAGE

TA

SMALL OUTLINE

(D)

PLASTIC DIP

(P)

–40

°C to 85°C

TPS6734ID

TPS6734IP

The D package is available taped and reeled. Add the suffix R

to the device type (e.g., TPS6734IDR).

TPS6734 chip information

Thermal compression or ultrasonic bonding can be used on the doped-aluminum bonding pad. Chips can be

mounted with conductive epoxy or a gold-silicon preform. Contact factory for die sales.

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4X4 MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%

ALL DIMENSIONS ARE IN MILS.

BONDING PAD ASSIGNMENTS

4

3

5

5

6

7

7

8

2

1

(1)

(2)

(3)

(4)

(5)

(5)

(6)

(7)

(7)

92

75

(8)

VCC

FB

OUT

GND

EN

REF

SS

COMP

1

2

3

4

8

7

6

5

TPS6734