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TPS6734 Datasheet(PDF) 2 Page - Texas Instruments |
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TPS6734 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 19 page TPS6734I FIXED 12-V 120-mA BOOST-CONVERTER SUPPLY SLVS127A – AUGUST 1995 – REVISED JANUARY 1999 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 AVAILABLE OPTIONS PACKAGE TA SMALL OUTLINE (D) PLASTIC DIP (P) –40 °C to 85°C TPS6734ID TPS6734IP The D package is available taped and reeled. Add the suffix R to the device type (e.g., TPS6734IDR). TPS6734 chip information Thermal compression or ultrasonic bonding can be used on the doped-aluminum bonding pad. Chips can be mounted with conductive epoxy or a gold-silicon preform. Contact factory for die sales. CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4X4 MINIMUM TJmax = 150°C TOLERANCES ARE ±10% ALL DIMENSIONS ARE IN MILS. BONDING PAD ASSIGNMENTS 4 3 5 5 6 7 7 8 2 1 (1) (2) (3) (4) (5) (5) (6) (7) (7) 92 75 (8) VCC FB OUT GND EN REF SS COMP 1 2 3 4 8 7 6 5 TPS6734 |
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