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LE25FW808 Datasheet(PDF) 2 Page - Sanyo Semicon Device |
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LE25FW808 Datasheet(HTML) 2 Page - Sanyo Semicon Device |
2 / 27 page LE25FW808 No.A0839-2/27 Continued from preceding page. • Serial interface : SPI mode 0, mode 3 supported • Sector size : 8K bytes/small sector, 64K bytes/sector • Small sector erase, sector erase, chip erase functions • Page program function (256 bytes/page) • High-Density read mode (HD_READ) • Block protect function • Highly reliable read/write Number of rewrite times : 100,000 times Small sector erase time : 80ms (typ.), 300ms (max.) Sector erase time : 100ms (typ.), 400ms (max.) Chip erase time : 250ms (typ.), 3s (max.) Page program time : 0.3ms/256 bytes (typ.), 0.5ms/256 bytes (max.) • Status functions Ready/busy information, protect information • Data retention period : 20 years • Package : LE25FW808TT MSOP8 (225mil) Package Dimensions unit:mm (typ) 3276 Figure 1 Pin Assignments CS SO (SIO3) WP (SIO2) VSS VDD HOLD (SIO1) SCK SI (SIO0) 1 2 3 4 8 7 6 5 5.2 1.27 (0.7) 0.125 1 4 8 5 0.35 SANYO : MSOP8(225mil) Top view |
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