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November 2006 ASM3P2107A rev 0.4 Peak EMI Reducing Solution 2 of 7 Notice: The information in this document is subject to change without notice. CLOCKOUT 1 2 3 4 5 6 7 8 ASM3P2107A XIN / CLKIN XOUT GND NC VDD NC NC Pin Configuration Pin Description Pin# Pin Name Type Description 1 XIN/CLKIN I Crystal connection or external reference frequency input. This pin has dual functions. It can be connected to either an external crystal or an external reference clock. 2 XOUT O Crystal connection. If using an external reference, this pin must be left unconnected. 3 GND P Ground to entire chip. 4 NC - No connect. 5 CLOCKOUT O Spread spectrum low EMI output. 6 VDD P Power supply for the entire chip (5V). 7 NC - No connect. 8 NC - No connect. Absolute Maximum Ratings Symbol Parameter Rating Unit VDD, VIN Voltage on any pin with respect to Ground -0.5 to +7.0 V TSTG Storage temperature -65 to +125 °C TA Operating temperature 0 to 70 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C TDV Static Discharge Voltage (As per JEDEC STD22- A114-B) 2 KV Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. |
