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ASM2P2304NZF-08-TT Datasheet(PDF) 3 Page - PulseCore Semiconductor |
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ASM2P2304NZF-08-TT Datasheet(HTML) 3 Page - PulseCore Semiconductor |
3 / 9 page January 2007 ASM2P2304NZ rev 1.1 Four Output PCI-X and General Purpose Buffer 3 of 9 Notice: The information in this document is subject to change without notice. Absolute Maximum Ratings Parameter Description Min Max Supply Voltage to Ground Potential -0.5 7 V DC Input Voltage (Except BUF_IN) -0.5 VDD + 0.5 V DC Input Voltage (BUF_IN) -0.5 7 V Storage Temperature -65 +150 °C Max. Soldering Temperature (10 sec) 260 °C Junction Temperature 150 °C Static Discharge Voltage (As per JEDEC STD22- A114-B) 2000 V Note: These are stress ratings only and functional usage is not implied. Exposure to absolute maximum ratings for prolonged periods can affect device reliability. Operating Conditions Parameter Description Min Max Unit VDD Supply Voltage 3.0 3.6 V TA Operating Temperature (Ambient Temperature) -40 85 °C CL Load Capacitance - 25 pF CIN Input Capacitance - 7 pF BUF_IN, OUTPUT [1:4] Operating Frequency DC 140 MHz tPU Power-up time for all VDD's to reach minimum specified Voltage (Power ramps must be monotonic) 0.05 50 mS |
Similar Part No. - ASM2P2304NZF-08-TT |
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Similar Description - ASM2P2304NZF-08-TT |
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