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| PQ60033HPA70 |
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 SYNQOR
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Product # PQ60033HPA70 Phone 1-888-567-9596 www.synqor.com Doc.# 005-2HP633K Rev. A 12/20/04 Page 2 Input: Input: Output: Output: Current: Current: P Package: ackage: 35-75 V 35-75 V 3.3 V 3.3 V 70 A 70 A Half-brick Half-brick T Technical S echnical Specification pecification 0.19 (4.8) 1.90 (48.26) 2.30 (58.4) 0.50 (12.7) 0.400 (10.16) 0.200 (5.08) 1.600 (40.64) Load Board Bottom side Clearance See Note 9 Lowest Component 1.400 (35.56) 2.40 (61.0) 0.400 (10.16) 1.000 (25.40) 1.400 (35.56) 0.700 (17.78) 0.45 (11.3) 0.037+/-0.034 (0.94+/-0.86) Top View Side View 0.145 (3.68) See Note 3 Flanged Pin See Note 10 MECHANICAL DIAGRAM Pin No. Name Function 1 Vin(+) Positive input voltage 2 ON/OFF TTL input to turn converter on and off, referenced to Vin(-), with internal pull up. 4 Vin(-) Negative input voltage 5 Vout(+) Positive output voltage 6 Vout(-) Negative output voltage 7 SENSE(-) Return remote sense 8 TRIM Output voltage trim 9 SENSE(+) Positive remote sense 10 Vout(+) Positive output voltage 11 Vout(-) Negative output voltage PIN DESIGNATIONS NOTES 1) Pins 1, 2, 4, 7-9 are 0.040” (1.02mm) diameter. with 0.080” (2.03mm) diameter standoff shoulders. 2) Pins 5-6, 10-11 are 0.080” (2.03 mm) diameter with 0.125” (3.18mm) diameter standoff shoulders. 3) Other pin extension lengths available. Recommended pin length is 0.03” (0.76mm) greater than the PCB thickness. 4) All Pins: Material - Copper Alloy Finish - Gold over Nickel plate 5) Undimensioned components are shown for visual reference only. 6) All dimensions in inches (mm) Tolerances: x.xx +/-0.02 in. (x.x +/-0.5mm) x.xxx +/-0.010 in. (x.xx +/-0.25mm) 7) Weight: 2.9 oz. (83 g) typical 8) Workmanship: Meets or exceeds IPC-A-610C Class II 9) UL/TUV standards require a clearance greater than 0.04” (1.02mm) between input and output for Basic insulation. This issue should be considered if any copper traces are on the top side of the user’s board. Note that the ferrite cores are considered part of the input/primary circuit. 10) The flanged pins are designed to permit surface mount soldeing (avoiding the wave soldering process) through the use of the flanged pin-in-paste technique. |
