TLV2422, TLV2422A, TLV2422Y

Advanced LinCMOS

™ RAIL-TO-RAIL OUTPUT

WIDE-INPUT-VOLTAGE MICROPOWER DUAL OPERATIONAL AMPLIFIERS

SLOS199B – SEPTEMBER 1997 – REVISED SEPTEMBER 1999

2

POST OFFICE BOX 655303

AVAILABLE OPTIONS

PACKAGED DEVICES

TA

VIOmax

AT 25

°C

SMALL

OUTLINE

(D)

CHIP CARRIER

(FK)

CERAMIC DIP

(JG)

TSSOP

(PW)

CERAMIC

FLAT PACK

(U)

CHIP FORM

(Y)

0

°C to 70°C

2.5 mV

TLV2422CD

—

—

TLV2422CPWLE

—

40

°Cto85°C

950

µV

TLV2422AID

—

—

TLV2422AIPWLE

—

– 40

°C to 85°C

µ

2.5 mV

TLV2422ID

—

—

—

—

40

°Cto125°C

950

µV

TLV2422AQD

—

—

—

—

TLV2422Y

– 40

°C to 125°C

µ

2.5 mV

TLV2422QD

—

—

—

—

–55

°Cto125°C

950

µV

—

TLV2422AMFK

TLV2422AMJG

—

TLV2422AMU

– 55

°C to 125°C

µ

2 mV

—

TLV2422MFK

TLV2422MJG

—

TLV2422MU

The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2422CDR). The PW package is available only left-end taped

and reeled. Chips are tested at 25

°C.

D OR JG PACKAGE

(TOP VIEW)

1

2

3

4

8

7

6

5

1OUT

1IN–

1IN +

2OUT

2IN –

2IN +

PW PACKAGE

(TOP VIEW)

NC

2OUT

2IN –

2IN +

NC

1OUT

1IN –

1IN +

1

2

3

4

5

10

9

8

7

6

U PACKAGE

(TOP VIEW)

32

1 20 19

910 11 12 13

4

5

6

7

8

18

17

16

15

14

NC

2OUT

NC

2IN –

NC

NC

1IN –

NC

1IN +

NC

FK PACKAGE

(TOP VIEW)

NC – No internal connection

1

2

3

4

8

7

6

5

1OUT

1IN –

1IN +

2OUT

2IN –

2IN +

NC – No internal connection