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TLV2221IDBV Datasheet(PDF) 3 Page - Texas Instruments |
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TLV2221IDBV Datasheet(HTML) 3 Page - Texas Instruments |
3 / 29 page TLV2221, TLV2221Y Advanced LinCMOS ™ RAIL-TO-RAIL VERY LOW-POWER SINGLE OPERATIONAL AMPLIFIERS SLOS157A – JUNE1996 – REVISED JANUARY 1997 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLV2221Y chip information This chip, when properly assembled, displays characteristics similar to the TLV2221C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 10 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (2) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + – OUT IN + IN – VDD + (5) (1) (3) (4) (2) VDD – / GND 40 (3) (2) (1) (5) (4) 32 |
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