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TLV2393 Datasheet(PDF) 5 Page - Texas Instruments |
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TLV2393 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 16 page TLV1393, TLV1393Y, TLV2393, TLV2393Y DUAL DIFFERENTIAL COMPARATORS SLCS121A – AUGUST 1993 – REVISED APRIL 1994 5 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLV2393Y chip information This chip, when properly assembled, displays characteristics similar to the TLV2393. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 3.6 × 3.6 MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (4) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + – 1OUT 1IN + 1IN – VCC (8) (6) (3) (2) (5) (1) – + (7) 2IN + 2IN – 2OUT (4) GND 32 38 (1) (2) (3) (4) (5) (6) (7) (8) |
Similar Part No. - TLV2393 |
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Similar Description - TLV2393 |
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