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TLE2227 Datasheet(PDF) 2 Page - Texas Instruments

Part No. TLE2227
Description  EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION DUAL OPERATIONAL AMPLIFIERS
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
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 2 page
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TLE2227, TLE2227Y, TLE2237, TLE2237Y
EXCALIBUR LOW-NOISE HIGH-SPEED
PRECISION DUAL OPERATIONAL AMPLIFIERS
SLOS184 – FEBRUARY 1997
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
symbol (each amplifier)
+
OUT
IN +
IN –
TLE2227Y chip information
This chip, properly assembled, displays characteristics similar to the TLE2227C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips my be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
× 4 MINIMUM
TJmax = 150°C
TOLERANCES ARE
±10%.
ALL DIMENSIONS ARE IN MILS.
+
1OUT
1IN +
1IN –
VCC+
(8)
(6)
(3)
(2)
(5)
(1)
+
(7)
2IN +
2IN –
2OUT
(4)
VCC–
116
104
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)




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