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TLE2227 Datasheet(PDF) 1 Page - Texas Instruments

Part No. TLE2227
Description  EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION DUAL OPERATIONAL AMPLIFIERS
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
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TLE2227, TLE2227Y, TLE2237, TLE2237Y
EXCALIBUR LOW-NOISE HIGH-SPEED
PRECISION DUAL OPERATIONAL AMPLIFIERS
SLOS184 – FEBRUARY 1997
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Outstanding Combination of DC Precision
and AC Performance:
Unity-Gain Bandwidth . . . 15 MHz Typ
Vn . . . 3.3 nV/√Hz at f = 10 Hz Typ,
2.5 nV/
√Hz at f = 1 kHz Typ
VIO . . . 100 µV Typ
AVD . . . 45 V/µV Typ With RL = 2 kΩ
38 V/
µV Typ With RL = 1 kΩ
D Available in 16-Pin Small-Outline
Wide-Body Package
D Macromodels and Statistical Information
Included
D Output Features Saturation Recovery
Circuitry
description
The TLE22x7C combines innovative circuit
design expertise and high-quality process control
techniques to produce a level of ac performance
and dc precision previously unavailable in dual
operational
amplifiers.
This
device
allows
upgrades to systems that use lower-precision
devices and is manufactured using Texas
Instruments state-of-the-art Excalibur process.
In the area of dc precision, the TLE22x7C offers a typical offset voltage of 100
µV, a common-mode rejection
ratio of 115 dB (typ), a supply voltage rejection ratio of 120 dB (typ), and a dc gain of 45 V/
µV (typ).
The ac performance is highlighted by a typical unity-gain bandwidth specification of 15 MHz, 55
° of phase
margin, and noise voltage specifications of 3.3 nV/
√Hz and 2.5 nV/√Hz at frequencies of 10 Hz and 1 kHz,
respectively.
The TLE22x7C is available in a wide variety of packages, including the industry standard 16-pin small-outline
wide-body version for high-density system applications. This device is characterized for operation from 0
°C to
70
°C.
AVAILABLE OPTIONS
V
typ
PACKAGED DEVICES
CHIP FORM‡
TA
VIOtyp
AT 25
°C
SMALL OUTLINE†
(DW)
PLASTIC DIP
(P)
CHIP FORM‡
(Y)
0
°Cto70°C
100
µV
TLE2227CDW
TLE2227CP
TLE2227Y
0
°C to 70°C
100
µV
TLE2237CDW
TLE2237CP
TLE2237Y
† The DW package is available taped and reeled. Add R suffix to device type (e.g., TLE2227CDWR).
‡ Chip forms are tested at 25
°C only.
Copyright
© 1997, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
2
3
4
8
7
6
5
1OUT
1IN –
1IN +
VCC–
VCC+
2OUT
2IN –
2IN +
P PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
NC
NC
1OUT
1IN –
1IN +
VCC–
NC
NC
NC
NC
VCC+
2OUT
2IN –
2IN +
NC
NC
DW PACKAGE
(TOP VIEW)
NC – No internal connection




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