TLC2652, TLC2652A, TLC2652Y

Advanced LinCMOS

™ PRECISION CHOPPER-STABILIZED

OPERATIONAL AMPLIFIERS

SLOS019C – SEPTEMBER 1988 – REVISED FEBRUARY 1999

3

POST OFFICE BOX 655303

TLC2652Y chip information

This chip, when properly assembled, displays characteristics similar to the TLC2652C. Thermal compression

or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with

conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

PIN (7) IS INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

FOR THE PINOUT, SEE THE FUNCTIONAL

BLOCK DIAGRAM.

90

80

(13)

(12)

(11)

(10)

(9)

(8)

(1)

(7)

(5)

(4)

(2)

(14)