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75117-1118 Datasheet(PDF) 1 Page - Molex Electronics Ltd.

Part # 75117-1118
Description  2.00 by 2.25mm (.079 by.089?? Pitch VHDM Stacking System
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Manufacturer  MOLEX [Molex Electronics Ltd.]
Direct Link  http://www.molex.com
Logo MOLEX - Molex Electronics Ltd.

75117-1118 Datasheet(HTML) 1 Page - Molex Electronics Ltd.

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2.00 by 2.25mm (.079 by
.089”) Pitch VHDM® 8-Row
Stacking System
75117
Board-to-Board
Connector System
VHDM® Board-to-Board 8-Row Stacker System Connects
High Speed, High Density for Mezzanine Boards
Molex’s 8-Row VHDM Stacker system allows for 2.5 Gbps data rates with high densities on mezzanine style
board-to-board applications, offering 100 real circuits per inch of connector. The VHDM Stacker system offers
the flexibility of a parallel board connection using the same proven wafer design, separable interface and
press-fit compliant pins as the standard VHDM connector family, with less than 5% crosstalk. VHDM Stackers
are ideal for both single-ended and differential signaling.
Reference Information
Packaging: Tube
UL File No.: E29179
CSA File No.: 152514 (LR19980)
Mates With: 74060
Designed In: Millimeters
Electrical
Voltage: 250V
Current: 1.0A
Contact Resistance: 13.5m
Ω max.
Dielectric Withstanding Voltage: 750VAC
Insulation Resistance: 500VDC
Mechanical
Contact Insertion Force: 45N max. per press-fit pin
Contact Retention to Housing: 9N min. per press-fit pin
Mating Force: 0.40N nominal per pin
Unmating Force: 0.15N min. per pin
Durability: 200 cycles
Physical
Housing: Liquid crystal polymer, UL 94V-0
Contact: Copper Alloy
Plating: Selective Gold 30µ" min. with Tin/Lead on the
tails
Operating Temperature: -55 to +105° C
SPECIFICATIONS
Features and Benefits
High speed, high density mezzanine design
enables up to 2.5 Gbps bandwidth per signal pair
2.00 by 2.25 mm (0.79 by 0.89”) pitch provides
40 contacts per centimeter
Wafer construction permits very accurate location
of ground planes relative to the signal contacts for
improved impedance control
Eye-of-the-needle press-fit receptacles and
headers allow tight spacing without solder
bridging between contact tails, repair ability and a
highly reliable termination to the PCB
Ground planes between signal columns provide:
- Tightly controlled impedance for rise times down
to 200 picoseconds
-Very low cross talk between signals within a
column
-Extremely low cross talk between signal columns
Mates with VHDM open headers permitting
utilization of existing standard backplane headers


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