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75117-1118 Datasheet(PDF) 1 Page - Molex Electronics Ltd. |
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75117-1118 Datasheet(HTML) 1 Page - Molex Electronics Ltd. |
1 / 2 page 2.00 by 2.25mm (.079 by .089”) Pitch VHDM® 8-Row Stacking System 75117 Board-to-Board Connector System VHDM® Board-to-Board 8-Row Stacker System Connects High Speed, High Density for Mezzanine Boards Molex’s 8-Row VHDM Stacker system allows for 2.5 Gbps data rates with high densities on mezzanine style board-to-board applications, offering 100 real circuits per inch of connector. The VHDM Stacker system offers the flexibility of a parallel board connection using the same proven wafer design, separable interface and press-fit compliant pins as the standard VHDM connector family, with less than 5% crosstalk. VHDM Stackers are ideal for both single-ended and differential signaling. Reference Information Packaging: Tube UL File No.: E29179 CSA File No.: 152514 (LR19980) Mates With: 74060 Designed In: Millimeters Electrical Voltage: 250V Current: 1.0A Contact Resistance: 13.5m Ω max. Dielectric Withstanding Voltage: 750VAC Insulation Resistance: 500VDC Mechanical Contact Insertion Force: 45N max. per press-fit pin Contact Retention to Housing: 9N min. per press-fit pin Mating Force: 0.40N nominal per pin Unmating Force: 0.15N min. per pin Durability: 200 cycles Physical Housing: Liquid crystal polymer, UL 94V-0 Contact: Copper Alloy Plating: Selective Gold 30µ" min. with Tin/Lead on the tails Operating Temperature: -55 to +105° C SPECIFICATIONS Features and Benefits ■ High speed, high density mezzanine design enables up to 2.5 Gbps bandwidth per signal pair ■ 2.00 by 2.25 mm (0.79 by 0.89”) pitch provides 40 contacts per centimeter ■ Wafer construction permits very accurate location of ground planes relative to the signal contacts for improved impedance control ■ Eye-of-the-needle press-fit receptacles and headers allow tight spacing without solder bridging between contact tails, repair ability and a highly reliable termination to the PCB ■ Ground planes between signal columns provide: - Tightly controlled impedance for rise times down to 200 picoseconds -Very low cross talk between signals within a column -Extremely low cross talk between signal columns ■ Mates with VHDM open headers permitting utilization of existing standard backplane headers |
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