FEATURES AND SPECIFICATIONS

SPECIFICATIONS

1.90 by 1.35mm

(.075” by .053”) Pitch

Backplane Connector System

4 Pair

Signal Headers

Connectors

The Impact backplane connector system provides data

rates over 20 Gbps and superior signal density up to

80 differential pairs per inch. The Impact System’s

broad-edge-coupled technology enables low cross-talk

and high signal bandwidth while minimizing channel

performance variation across every differential pair

within the system.

Molex’s Impact System offers multiple compliant-pin

design options on both the daughtercard and backplane

connectors, providing customers ultimate flexibility

to optimize their designs for superior mechanical and

electrical performance. The Impact system’s mating

interface provides inline-staggered, bifurcated contacts

that provide 2 points of contact for long-term reliability

performance and built-in ground-signal sequencing.

This reduces the average mating force per connector

to improve the mechanical mating performance of

the system.

The Impact backplane connector system is designed for

traditional backplane and/or midplane architectures

to meet the growing demands of next-generation

telecommunication and data networking equipment

manufacturers. The Impact connector system is offered

in 3-, 4-, 5- and 6-pair versions, with a complete range

of guidance and power-solution options. For more

information on Molex’s Impact backplane connector

system, contact impact@molex.com

Molex’s Impact backplane connector system pushes the speed and density envelope to meet the

growing demands of next generation telecommunication and data networking equipment

Features and Benefits

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Data rates over 20 Gbps support future system

performance upgrades

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Broad-edge-coupled, differential-pair system for

superior density, low cross-talk, low insertion loss

and minimal performance variation across all high-

speed channels

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Differential pair density up to 80 pairs per

linear inch provides the highest speed, highest

differential pair density per square inch in the

industry

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IEEE 10GBASE-KR and Optical Internetworking

Forum (OIF) Stat Eye Compliant channel

performance demonstrates end-to-end channel

performance compliance

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PCB routing flexibility provides simple 1.90 by

1.35mm (.075 by .053”) grid on both backplane

and daughtercard reduces PCB routing complexity

and costs

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Two compliant-pin attach options provide customers

ultimate flexibility to optimize their designs for

superior mechanical and electrical performance

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Inline staggered, bifurcated contact beams in

daughtercard interface for superior mating

performance with two points of contact for

long-term reliability and built-in ground-signal

sequencing

Reference Information

Packaging: Trays

UL File No.: Pending

CSA File No.: Pending

Designed In: Millimeters

Electrical

Signal Contact Current Rating: 1.0A

Contact to Plated Through-Hole Resistance:

1.0 milliohm max.

Dielectric Withstanding Voltage: 750V RMS

Insulation Resistance: 10,000 Megohms min.

Mechanical

Contact Insertion Force:

35.6N (8 lb) per contact.

Contact Retention Force:

4.45N (1.0 lb) min. per contact

Mating Force: 0.69N (0.15 lb) max. per contact

Durability: 200 cycles

Physical

Housing: Liquid Crystal Polymer, UL 94V-0

Contact: High Performance Copper (Cu) Alloy

Plating:

Contact Area — 0.76µm (30µ”) Gold (Au) min.

Termination Area — Tin (Sn) or Tin/Lead (Sn/Pb)

Underplating – Nickel (Ni)

PCB Thickness: 1.60mm (.062”) typical

Operating Temperature: -55 to +85°C max.

Impact 4 Pair by 10 Column Guide Left

Impact 4 Pair by 10 Column Red Card Demo