FEATURES AND SPECIFICATIONS

SPECIFICATIONS

0.80mm (.031”) Pitch

SFP Stacked Multi-Port

Connectors

75310, 75786, 75460, 75787,

75462, 75640, 75759, 75714,

75454, 75450, 75733, 75734,

75477, 75451

Molex is rapidly expanding its Small Form-factor

Pluggable (SFP) product offering to meet the demands

of networking and storage industries, which require

denser and faster packaging for high-speed serial

interfaces. The new SFP Stacked Multi-Port Connectors

are the latest additions to Molex’s extensive SFP

product line.

These new connectors offer high port density with

complete integration of stacked 20-circuit SFP

connector ports within a cage. Integrated lightpipes are

available to provide port-status indication to the user.

The product line encompasses connectors offered in

two heights and is available in five port configurations:

2-by-1, 2-by-2, 2-by-4, 2-by-5 and 2-by-6.

Molex’s SFP Stacked Multi-Port Connectors accept SFP

MSA-compliant modules, allowing installers to

configure and upgrade high-speed Ethernet and Fibre

Channel (FC) ports. Tin/Lead press-fit connector tails

are provided as the standard option. Tin-plated tails

will also be available to meet lead-free requirements.

Contact Molex for additional information.

Reference Information

Packaging: Tray

UL File No.: E29179

CSA File No.: LR19980

Mates With: SFP MSA-compliant modules

Designed In: Millimeters

Electrical

Voltage: 120V

Current: 0.5A max.

Dielectric Withstanding Voltage: 300V

Insulation Resistance: 1 Megohm

Mechanical

Insertion Force to PCB: 35.59N (8 lb) per

compliant pin, max.

Mating Force: 40N (8.99 lb) max.

Unmating Force: 11.5N (2.59 lb) max.

Durability: 100 cycles

Physical

Housing: High-temperature plastic, Glass-filled

Contact: Tin/Brass (Sn/CuZn)

Plating:

Contact Area — Gold (Au)

Solder Tail Area — Tin/Lead (Sn/Pb) or Tin (Sn)

Underplating — Nickel (Ni)

PCB Thickness: 2.36mm (0.093”)

Operating Temperature: -40 to +85°C

Features and Benefits

requirements and is capable of speeds up to 10Gbps

configurations (2, 4, 8, 10 and 12) providing

greater port density and reduced PCB assembly

labor

color SMT LED’s provides port status and activity

feedback

assuring ease of module removal from the port

25.50mm (1.000”) and tall 29.30mm (1.150”);

Medium-height connectors meet industry standard

and are consistent with the stacked multi-port

modular jack design; Tall-height connector (2-by-1

only) is designed for 1U applications

Upgrade to high-speed Ethernet and Fibre Channel ports with Molex’s Stacked

Multi-Port SFP Connectors

Multi-port connectors with lightpipes