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75003-0005 Datasheet(PDF) 1 Page - Molex Electronics Ltd. |
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75003-0005 Datasheet(HTML) 1 Page - Molex Electronics Ltd. |
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1 / 2 page  Plateau HS Mezz™ High Speed Mezzanine for 10.0 Gbps Bandwidth 75003, 75005 SPECIFICATIONS ■ Advanced gold-plated plastic housings with integrated shielding system support high-speed differential signaling in excess of 10.0 Gbps ■ Impedance of 100 ± 10 ohms at 50 psec risetime (10/90%) maintained for all stack heights to ensure very low crosstalk between signals ■ Contacts on 1.20mm (.047”) pitch arranged in isolated differential pairs on 3.50mm (.138”) pitch for controlled impedance ■ Two points of contact on each signal ensure high reliability ■ Multiple stack heights from 9.00 to 23.00mm (.354 to .906”) to meet nearly every parallel board requirement, with capability up to 25.00mm (.984”) ■ Available in 6, 12, 24 and 36 differential pair sizes (12, 24, 48 and 72 total contacts) to accommodate a range of applications ■ Molded and plated housing pegs facilitate attachment to PCB ground plane Features and Benefits High Speed Mezzanine Connectors Feature Innovative Plated Plastic Housing for Outstanding Performance Molex utilizes its proprietary Plateau Technology™ to create a high-speed, superior performance surface- mounted mezzanine connector system. This technology permits the customer to use a smaller footprint connector than other typical designs, translating into savings on circuit count and board space. The shielding properties of the plated housing effectively isolate each differential pair, eliminating the need to use signal pins for ground. These mezzanine connectors are ideal for servers, mainframe computers, workstations, test equipment and telecommunications equipment such as switches and routers. Reference Information Packaging: Tape and Reel or Tube Designed In: Millimeters UL File No.: E29179 CSA File No.: LR19980 Electrical Voltage: 30V DC Current: 1.5A max. Contact Resistance: 25 milliohms Dielectric Withstanding Voltage: 500V Insulation Resistance: 1,000 Megohms Impedance: 100 +/- 10 Ohms @ 50psec risetime Mechanical Mating Force: 2.0N (.45lb) max. per circuit Unmating Force: 0.9N (.20lb) min. per circuit Durability: 25 cycles Physical Housing: LCP Contact: Copper Alloy Plating: Contact Area – 0.76µm (30µ”) min. select Gold and 3.81µm (150µ”) min. select Tin/Lead over 1.27µm (50µ”) min. Nickel overall Housing – 0.10µm (4µ”) max. Gold over 3.81µm (150µ”) min. Nickel over 3.81µm (150µ”) min. Copper Operating Temperature: -20 to +85°C SMT Lead Coplanarity: 0.102mm (.004”) |
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