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L3-2R2 Datasheet(PDF) 6 Page - Superworld Electronics |
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L3-2R2 Datasheet(HTML) 6 Page - Superworld Electronics |
6 / 9 page NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 01.04.2008 FERRITE CHIP INDUCTORS L3 SERIES 9. SOLDERIND AND MOUNTING : products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering seen by the circuit when immersed in the molten solder wave, typical at 230°C. Due to the risk of thermal damage to 9-2.2 Solder Wave : Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature 9-1. Recommended PC Board Pattern air soldering tools. 9-2.3 Soldering Iron (Figure 3) : 9-2.1 Lead Free Solder Re-flow : wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a) Preheat circuit and products to 150°C. b) 350°C tip temperature (max) 60~120s Figure 1. Re-flow Soldering 30~60s c) Never contact the ceramic with the iron tip a soldering iron must be employed the following precautions are recommended. 230 250 ~ 260 150 180 Preheating Note : 9-2. Soldering 330 Over 2min. Figure 2. Wave Soldering Gradual Cooling Within 3s e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 3 secs. d) 1.0mm tip diameter (max) Soldering cooling Natural 260 245 150 under mechanical stress as warping the board. the mechanical stress to prevent failure. Products shall be positioned in the sideway direction against PC board should be designed so that products are not sufficient Figure 3. Hand Soldering Gradual Cooling Over 1min. Time(sec.) 350 150 Preheating Soldering cooling Natural Preheating Soldering cooling Natural (max.) (max.) 3s 10s 10s max. 2.60 0.60 is shown in Fig. 2 |
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