NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 4

15.01.2008

FERRITE CHIP INDUCTORS

L4 SERIES

8. RELIABILITY & TEST CONDITION :

Bending

40(1.575)

not be damaged by the forces applied on the

The terminal electrode & the dielectric must

Flexture Strength

100(3.937)

45(1.772)

right conditions.

45(1.772)

20(.787)

Solder a chip on a test substrate, bend the substrate

by 2mm (0.079in) and return.

TEST CONDITION

PERFORMANCE

not be damaged by the forces applied on the

The terminal electrode & the dielectric must

More than 90% of the terminal electrode

Refer to standard electrical characteristics list

10±0.5

seconds

60

seconds

Terminal Strength

Solderability

right conditions.

W

should be covered with solder.

60

seconds

Preheating

245°C

150°C

4±1.0

seconds

cooling

Dipping

Natural

Solder Heat Resistance

Temperature Rise Test

Electrical Characteristics Test

Rated Current

DC Resistance

Impedance

Preheating

30°C max. ( t)

260°C

150°C

Dipping

cooling

Natural

For Z / L Series :

Solder : Sn-Ag3.0-Cu0.5

Flux for lead free : rosin

Dip Time : 4±1sec.

Preheat : 150°C, 60sec.

Solder Temperature : 245±5°C

2. Temperature measured by digital surface thermometer.

Flux for lead free : rosin

Dip Time : 10±0.5sec.

Preheat : 150°C, 60sec.

Solder : Sn-Ag3.0-Cu0.5

Solder Temperature : 260±5°C

1. Applied the allowed DC current.

HP4291A, HP4287A+16092A

HP4338B

No mechanical damage

Remaining terminal electrode : 70% min.

W

ITEM

0.2

1

2.0

8

1.0

5

6

7

1.0

1.5

2

3

4

0.6

0.5

1.0

> 25

Size

Force (Kfg)

Time (sec)