Features and speciFications

1.85 by 1.85mm

(.073 by .073”) pitch GbX*

Backplane connector system

in 2, 3, 4 and 5-pair columns

2 and 3 columns:

daughtercard

assemblies

assemblies

assemblies

Headers

Headers

4 and 5 columns:

assemblies

75420

4-pair Lite

daughtercard

assemblies

75426

4-pair Hybrid

daughtercard

assemblies

Headers

75465

4-pair Lite Backplane

signal Header

stand-alone Guide pin Kit:

75234

Features and Benefits

Data rates up to 10 Gbps may now be achieved with

the GbX 2 and 3-pair column daughtercard and

backplane system. The 2 and 3-pair column system

completes the GbX product offering, making it a

complete solution for high-end telecommunication and

datacommunication applications.

The GbX connector system provides the speed,

density, and low-applied cost required by leading-

edge backplane applications. It is especially suited

for designs that require future speed upgrades by

daughtercard replacement into an existing backplane.

With native differential signaling speeds up to 10 Gbps,

GbX is well suited for existing and future generations

of XAUI (10 Gigabit Attachment Unit Interface) and

and OIF (Optical Internetworking Forum) chip

protocols.

Internetworking and telecommunication equipment

engineers will benefit by the GbX connector’s ability

to provide not only a high-density, low applied-cost

solution in the near term, but also by its electrical

performance in upgradeable systems. Speeds of 10

Gbps have been demonstrated with appropriate SERDES

(Serializer/ Deserializer) devices and board-material

selection. This allows system architects freedom-of-

design for faster future systems without the worry of

backward compatibility, along with the economy of a

common backplane for two generations of equipment.

In addition, the GbX Lite Series system provides a

complimentary high-density open pin field for cost-

effective design of slower-speed circuits along the same

stiffener as the standard, high-speed GbX wafers. For

more information on Molex’s extensive GbX offering,

please visit: www.molex.com/product/backplan/gbx.

html.

*GbX and VHDM-HSD are registered trademarks of Amphenol

Corporation

†

InfiniBand is a registered trademark of the InfiniBand Trade

Association

‡

ATCA is a trademark of the PCI Industrial Manufacturers

Group

2 and 3-Pair Columns add to Molex’s GbX Backplane Interconnect System Offering, Delivering

Speeds Up To 10 Gbps, High Density (Up to 69 Mated Differential Channels Per Inch) and is

Custom Configurable

n

Up to 69 real differential pairs per linear inch (27

real differential pairs per 10.00mm (.393”) offers

high density with more differential pairs per linear

inch than VHDM-HSD*

n

Bifurcated contact beams in daughtercard

receptacle provide greater reliability with two

points of contact to header pin

n

Modular daughtercard components with GbX

L-Series available with custom, cost-effective

receptacle assemblies

n

Optimized differential pair contacts for easier

board trace routing

n

Data rate options up to 10 Gbps are able to support

future daughtercard speed upgrades

Top, left to right: 75360, 75220, 75370, 75650. Bottom, left to right: 75237, 75235, 75433, 75827