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75237-0104 Datasheet(PDF) 1 Page - Molex Electronics Ltd. |
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75237-0104 Datasheet(HTML) 1 Page - Molex Electronics Ltd. |
1 / 3 page Features and speciFications 1.85 by 1.85mm (.073 by .073”) pitch GbX* Backplane connector system in 2, 3, 4 and 5-pair columns 2 and 3 columns: 75650, 75370 differential daughtercard assemblies 75670, 75660 Lite daughtercard assemblies 75676, 75666 Hybrid daughtercard assemblies 75827, 75433 Backplane signal Headers 75861, 75649 Lite Backplane signal Headers 75492, 75331 Backplane power 4 and 5 columns: 75220, 75360 daughtercard assemblies 75420 4-pair Lite daughtercard assemblies 75426 4-pair Hybrid daughtercard assemblies 75235, 75237 Backplane signal Headers 75465 4-pair Lite Backplane signal Header 75341, 75510 Backplane power stand-alone Guide pin Kit: 75234 Features and Benefits Data rates up to 10 Gbps may now be achieved with the GbX 2 and 3-pair column daughtercard and backplane system. The 2 and 3-pair column system completes the GbX product offering, making it a complete solution for high-end telecommunication and datacommunication applications. The GbX connector system provides the speed, density, and low-applied cost required by leading- edge backplane applications. It is especially suited for designs that require future speed upgrades by daughtercard replacement into an existing backplane. With native differential signaling speeds up to 10 Gbps, GbX is well suited for existing and future generations of XAUI (10 Gigabit Attachment Unit Interface) and InfiniBand† based systems, in addition to those based on ATCA‡ (Advanced Telecom Computing Architecture) and OIF (Optical Internetworking Forum) chip protocols. Internetworking and telecommunication equipment engineers will benefit by the GbX connector’s ability to provide not only a high-density, low applied-cost solution in the near term, but also by its electrical performance in upgradeable systems. Speeds of 10 Gbps have been demonstrated with appropriate SERDES (Serializer/ Deserializer) devices and board-material selection. This allows system architects freedom-of- design for faster future systems without the worry of backward compatibility, along with the economy of a common backplane for two generations of equipment. In addition, the GbX Lite Series system provides a complimentary high-density open pin field for cost- effective design of slower-speed circuits along the same stiffener as the standard, high-speed GbX wafers. For more information on Molex’s extensive GbX offering, please visit: www.molex.com/product/backplan/gbx. html. *GbX and VHDM-HSD are registered trademarks of Amphenol Corporation † InfiniBand is a registered trademark of the InfiniBand Trade Association ‡ ATCA is a trademark of the PCI Industrial Manufacturers Group 2 and 3-Pair Columns add to Molex’s GbX Backplane Interconnect System Offering, Delivering Speeds Up To 10 Gbps, High Density (Up to 69 Mated Differential Channels Per Inch) and is Custom Configurable n Up to 69 real differential pairs per linear inch (27 real differential pairs per 10.00mm (.393”) offers high density with more differential pairs per linear inch than VHDM-HSD* n Bifurcated contact beams in daughtercard receptacle provide greater reliability with two points of contact to header pin n Modular daughtercard components with GbX L-Series available with custom, cost-effective receptacle assemblies n Optimized differential pair contacts for easier board trace routing n Data rate options up to 10 Gbps are able to support future daughtercard speed upgrades Top, left to right: 75360, 75220, 75370, 75650. Bottom, left to right: 75237, 75235, 75433, 75827 |
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