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73931-3231 Datasheet(PDF) 2 Page - Molex Electronics Ltd. |
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73931-3231 Datasheet(HTML) 2 Page - Molex Electronics Ltd. |
2 / 2 page Reference Information Packaging: Trays UL File No.: Pending CSA File No.: Pending Mates With Cable Assemblies: iPass+ Passive (Series111025), iPass+ Active (Series 111026) Designed In: Millimeters Electrical Voltage: 30V Current: 0.5A Contact Resistance: Dielectric Withstanding Voltage: 500V AC Insulation Resistance: 1000 Megohms Mechanical Contact Insertion Force: 35N (7.868 lbf) per circuit max. Mating Force: 2.36 N (.531 lbf) per circuit Unmating Force: 0.15N (.034 lbf) per circuit Durability: 250 cycles Physical Housing: LCP Contact: Copper (Cu) Alloy Plating: Contact Area — 30µ” Gold (Au) min. Solder Tail Area — 100µ” Tin (Sn) min. Under plating — 50µ” Nickel (Ni) PCB Thickness: 1.77mm (.070”) min. RoHS compliant: Yes Operating Temperature: -40 to +105°C n Integrated press-fit connector assembly with cage provides one-step placement to PCB n Four integral screw-mount hold downs applied from bottom of PCB provide optimal retention of die-cast assembly to PCB without taking up additional board real estate n Low-profile height, 13.13mm (.517”) from top of host board conforms to standard and low- profile PCIe card form factors n Robust guide pins located on each side of the guide ensure assembly alignment to PCB n Front elastomeric gasket provides improved electro magnetic interference (EMI) protection between guide and face plate n Ground-pad alleys are located at the rear of the die cast assembly provide ease of routing off top layers of PCB Americas Headquarters Lisle, IL 60532 U.S.A. 1-800-78MOLEX amerinfo@molex.com Asia Pacific North Headquarters Yamato, Kanagawa, Japan 81-46-265-2325 apninfo@molex.com Asia Pacific South Headquarters Jurong, Singapore 65-6268-6868 fesinfo@molex.com European Headquarters Munich, Germany 49-89-413092-0 eurinfo@molex.com Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. 630-969-4550 Fax:630-969-1352 Visit our website at www.molex.com/product/ipass.html Order No. 987650-1632 Printed in USA/K/2008.01 ©2008, Molex SPECIFICATIONS ORDERING INFORmATION Order No. Channels Circuit Size Plating 76105-0084 Up to 12 84 30µ” Gold (Au) Order No. Lane Circuits 73931-3231 x12 84 0.80mm (.031”) Pitch iPass+ 84-Circuit 120 Gbps Products 76105 Integrated Connector and Cage Assembly Features and Benefits Connector iPass+ Test Board |
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