EMP311

Specifications are subject to change without notice.

Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085

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Revised September 2004

PRELIMINARY DATA SHEET

21.0 – 24.0 GHz Power Amplifier MMIC

ASSEMBLY DRAWING

The length of RF wires should be as short as possible. Use at least two wires between RF pad and 50 ohm line

and separate the wires to minimize the mutual inductance.

CHIP OUTLINE

Chip size 1130 X 2250 microns

Chip Thickness: 75

±13 microns

PAD Dimensions: 100 x 100 microns

All Dimensions in Microns