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EMP110 Datasheet(PDF) 3 Page - Excelics Semiconductor, Inc. |
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EMP110 Datasheet(HTML) 3 Page - Excelics Semiconductor, Inc. |
3 / 3 page EMP110 UPDATED 12/15/2004 5.9 – 7.9 GHz Power Amplifier MMIC Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 page 3 of 3 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Revised December 2004 ASSEMBLY DRAWING The length of RF wires should be as short as possible. Use at least two wires between RF pad and 50 ohm line and separate the wires to minimize the mutual inductance. Chip Size 1130 x 2250 microns Chip Thickness: 85 ± 15 microns PAD Dimensions: 100 x 100 microns All Dimensions in Microns CHIP OUTLINE |
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