EMP110

UPDATED 12/15/2004

5.9 – 7.9 GHz Power Amplifier MMIC

Specifications are subject to change without notice.

Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085

page 3 of 3

Revised December 2004

ASSEMBLY DRAWING

The length of RF wires should be as short as possible. Use at least two wires between RF pad and 50 ohm line

and separate the wires to minimize the mutual inductance.

Chip Size 1130 x 2250 microns

Chip Thickness: 85

± 15 microns

PAD Dimensions: 100 x 100 microns

All Dimensions in Microns

CHIP OUTLINE