ADP3419

Rev. 2 | Page 5 of 13 | www.onsemi.com

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VCC

−0.3 V to +7 V

BST

−0.3 V to +30 V

BST to SW

−0.3 V to +7 V

SW

−3 V to +25 V

DRVH

SW − 0.3 V to BST + 0.3 V

DRVL

−0.3 V to VCC + 0.3 V

All Other Inputs and Outputs

−0.3 V to VCC + 0.3 V

2-Layer Board

340°C/W

4-Layer Board

220°C/W

Operating Ambient Temperature

Range

0°C to 100°C

Junction Temperature Range

0°C to 150°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature Range

Soldering (10 s)

300°C

Vapor Phase (60 s)

215°C

Infrared (15 s)

220°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those listed in the operational sections

of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Unless otherwise specified, all voltages are referenced to GND.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the

human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.