SN54LVT125, SN74LVT125

3.3-V ABT QUADRUPLE BUS BUFFERS

WITH 3-STATE OUTPUTS

SCBS133D – MAY 1992 – REVISED JULY 1995

1

POST OFFICE BOX 655303

Technology (ABT) Design for 3.3-V

Operation and Low-Static Power

Dissipation

Down to 2.7 V

MIL-STD-883C, Method 3015; Exceeds

200 V Using Machine Model

(C = 200 pF, R = 0)

Per JEDEC Standard JESD-17

for External Pullup Resistors

Small-Outline (D), Shrink Small-Outline

(DB), and Thin Shrink Small-Outline (PW)

Packages, Ceramic Chip Carriers (FK), and

Ceramic (J) DIPs

description

provide a TTL interface to a 5-V system environment.

The

′LVT125 feature independent line drivers with 3-state outputs. Each output is in the high-impedance state

when the associated output-enable (OE) input is high.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74LVT125 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count

and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54LVT125 is characterized for operation over the full military temperature range of – 55

°C to 125°C. The

SN74LVT125 is characterized for operation from – 40

°C to 85°C.

Copyright

© 1995, Texas Instruments Incorporated

UNLESS OTHERWISE NOTED this document contains PRODUCTION

DATA information current as of publication date. Products conform to

specifications per the terms of Texas Instruments standard warranty.

Production processing does not necessarily include testing of all

parameters.

SN54LVT125 ...J PACKAGE

SN74LVT125 . . . D, DB, OR PW PACKAGE

(TOP VIEW)

1

2

3

4

5

6

7

14

13

12

11

10

9

8

1OE

1A

1Y

2OE

2A

2Y

GND

4OE

4A

4Y

3OE

3A

3Y

32

1 20 19

910 11 12 13

4

5

6

7

8

18

17

16

15

14

4A

NC

4Y

NC

3OE

1Y

NC

2OE

NC

2A

SN54LVT125 . . . FK PACKAGE

(TOP VIEW)

NC – No internal connection

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.