Dated : 12/02/2009
V
SEMTECH ELECTRONICS LTD.
(
Subsidiary of Sino-Tech International Holdings Limited, a company
listed on the Hong Kong Stock Exchange, Stock Code: 724)
®
EGL34A THRU EGL34G
SURFACE MOUNT GLASS PASSIVATED ULTRAFAST RECTIFIER
Reverse Voltage - 50 to 400 V
Forward Current - 0.5 A
Features
• Plastic package has Underwriters Laboratories
Flammability Classification 94V-0
• High temperature metallurgically bonded construction
• Cavity-free glass passivated junction
• Fast switching for high efficiency
Mechanical Data
• Case: MiniMELF (DO-213AA), molded plastic body
• Terminals: Solder plated, solderable per MIL-STD-750,
method 2026
• Polarity: Color band denotes cathode end
• Mounting Position: Any
Absolute Maximum Ratings and Characteristics
Ratings at 25 OC ambient temperature unless otherwise specified.
Parameter
Symbols EGL34A EGL34B EGL34C EGL34D EGL34F EGL34G Units
Maximum Repetitive Peak Reverse Voltage
VRRM
50
100
150
200
300
400
V
Maximum RMS Voltage
VRMS
35
70
105
140
210
280
V
Maximum DC Blocking Voltage
VDC
50
100
150
200
300
400
V
Maximum Average Forward Rectified Current
at TT = 75 OC
IF(AV)
0.5
A
Peak Forward Surge Current 8.3 ms Single Half Sine
Wave Superimposed on Rated Load (JEDEC Method)
IFSM
10
A
Maximum Forward Voltage at 0.5 A
VF
1.25
1.35
V
Maximum Reverse Current
TA = 25 OC
at Rated DC Blocking Voltage
TA = 125 OC
IR
5
50
μA
Maximum Reverse recovery time
1)
trr
50
ns
Typical Junction Capacitance
2)
CJ
7
pF
Typical Thermal Resistance
3), 4)
RθJA
RθJT
150
70
O
C/W
Operating and Storage Temperature Range
Tj ,Tstg
- 65 to + 175
O
C
1) Test conditions: IF = 0.5 A, IR = 1 A, Irr = 0.25 A
2) Measured at 1 MHz and applied reverse voltage of 4 VDC.
3) Thermal resistance from junction to ambient, 0.24" X 0.24"(6 X 6 mm) copper pads to each terminals.
4) Thermal resistance from junction to terminal, 0.24" X 0.24"(6 X 6 mm) copper pads to each terminals.
MiniMELF (DO-213AA) Plastic Package
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