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KH232AK Datasheet(PDF) 4 Page - Cadeka Microcircuits LLC. |
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KH232AK Datasheet(HTML) 4 Page - Cadeka Microcircuits LLC. |
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4 / 6 page  DATA SHEET KH232 4 REV. 1A January 2004 Operation The KH232 is based on the current feedback op amp topology, a design that uses current feedback instead of the usual voltage feedback. The use of the KH232 is basically the same as that of the conventional op amp (see Figures 1 and 2). Since the device is designed specifically for low gain applications, the best performance is obtained when the circuit is used at gains between ±1 and ±5. Additionally, performance is optimum when a 250 Ω feedback resistor is used. Figure 1: Recommended non-inverting gain circuit Figure 2: Recommended inverting gain circuit Layout Considerations To assure optimum performance the user should follow good layout practices which minimize the unwanted coupling of signals between nodes. During initial bread- boarding of the circuit use direct point to point wiring, keeping the lead lengths to less than 0.25”. The use of solid, unbroken ground plane is helpful. Avoid wire-wrap type pc boards and methods. Sockets with small, short pin receptacles may be used with minimal performance degradation although their use is not recommended. During pc board layout keep all traces short and direct The resistive body of Rg should be as close as possible to pin 5 to minimize capacitance at that point. For the same reason, remove ground plane from the vicinity of pins 5 and 6. In other areas, use as much ground plane as possible on one side of the board. It is especially important to provide a ground return path for current from the load resistor to the power supply bypass capacitors. Ceramic capacitors of 0.01 to 0.1 µf (with short leads) should be less than 0.15 inches from pins 1 and 9. Larger tantalum capacitors should be placed within one inch of these pins. VCC connections to pins 10 and 12 can be made directly from pins 9 and 1, but better supply rejection and settling time are obtained if they are separately bypassed as in figures 1 and 2. To prevent signal distortion caused by reflections from impedance mismatches, use terminated microstrip or coaxial cable when the signal must traverse more than a few inches. Since the pc board forms such an important part of the circuit, much time can be saved if prototype boards of any high frequency sections are built and tested early in the design phase. Evaluation boards designed for either inverting or non-inverting gains are available. Offset Voltage Adjustment If trimming of the input offset voltage (Vos = Vni -Vin) is desired, a resistor value of 10k Ω to 1MΩ placed between pins 8 and 9 will cause Vos to become more negative by 8mV to 0.2mV respectively. Similarly, a resistor placed between pins 1 and 2 will cause Vos, to become more positive. Thermal Considerations At high ambient temperatures or large internal power dissipations, heat sinking is required to maintain acceptable junction temperatures. Use the thermal model on the previous page to determine junction temperatures. Many styles of heat sinks are available for TO-8 packages; the Thermalloy 2240 and 2268 are good examples. Some heat sinks are the radial fin type which cover the pc board and may interfere with external components. An excellent solution to this problem is to use surface mounted resistors and capacitors. They have a very low profile and actually improve high frequency performance. For use of these heat sinks with conventional components, a 0.1” high spacer can be inserted under the TO-8 package to allow sufficient clearance. 33 Ω +15V 0.1 3.9 .01 Capactance in µF 1 12 5 3,7 RL 100 Ω 10 11 33 Ω .01 0.1 3.9 -15V 9 + - KH232 Vo Rf = 250Ω 6 Rg Vin Ri 49.9 Ω A R R v f g = 1+ 250 Ω 33 Ω +15V 0.1 3.9 .01 Capactance in µF 1 12 5 3,7 RL 100 Ω 10 11 33 Ω .01 0.1 3.9 -15V 9 + - KH232 Vo Rf = 250Ω For Zin = 50Ω, select Rg || Ri = 50Ω 6 100 Ω Vin Ri 250 Ω Rg A R R v f g = − |
Similar Part No. - KH232AK |
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Similar Description - KH232AK |
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