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ZMM55C51 Datasheet(PDF) 2 Page - SeCoS Halbleitertechnologie GmbH |
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ZMM55C51 Datasheet(HTML) 2 Page - SeCoS Halbleitertechnologie GmbH |
2 / 2 page Absolute Maximum Ratings Items Symbol Value Unit Power Dissipation at Tamb=25℃ PTOT 500 * mW Junction Temperature TJ 175 ℃ Storage Temperature Range TSTG -65 ~ +175 ℃ * Valid provided that leads at a distance of 10mm from case are kept at ambient temperature Characteristic at Tamb=25℃ Items Symbol Min. Typ. Max. Unit Thermal Resistance Junctiobn to Ambient Air R θJA - - 0.3 * K / mW Forward Voltage @ IF=200mA VF - - 1.0 V * Valid provided that leads at a distance of 10mm from case are kept at ambient temperature Items Materials Package Mini MELF Case H Packaging Dimensions (mm) ermeticall sealed glass L Symbol Min Max ead Finish Solder Plating A B C 3.302 1.397 0.350 3.505 1.499 0.500 A B C Mechanical Data Dimensions in mm MINI MELF http://www.SeCoSGmbH.com/ Any changing of specification will not be informed individual 5 10 15 20 25 30 50 V 40 30 20 10 0 Breakdown Characteristics IZ VZ ZMM55 Series mA Test currrent Iz=5mA due to the ambient temperature. 500 Change in the power dissipation 250 200 50 100 150 200 Ta (℃) Ambient Temperature. 100 400 300 21-Aug-2007 Rev.B Page 2 of 2 |
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