DATA SHEET

SKY77182 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA

(1920–1980 MHz)

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

8

February 14, 2008 • Skyworks Proprietary and Confidential Information. • Products and product Information are subject to change without notice. • 200850A

0.6

0.6

0.4

0.2

0.7

1.1

3

3.2

1.4

0.7

0.5

0.4

1.1

3

3.2

2.1

STENCIL APERTURE

TOP VIEW

APPROACH 1

0.25

0.8 TYP

3

3.2

0.4

STENCIL APERTURE

TOP VIEW

APPROACH 2

METALLIZATION

TOP VIEW

2.65

3

3.3

0.8 TYP

0.8 TYP

0.8 TYP

Thermal Via Array

Ø0.3 mm on 0.5 mm Pitch

Additional vias will improve

thermal performance.

NOTE: Thermal Vias should

be tented and filled with

solder mask 30–35 μm Cu

plating recommended

SOLDER MASK OPENING

TOP VIEW

0.6

200565_005

ALL DIMENSIONS IN MILLIMETERS

Common Ground

Pad

Component

Outline

Component

Outline

Component

Outline

Component

Outline

Figure 5. Phone PCB Layout Footprint for 3 x 3 x 0.9 mm, 8-pad Package – SKY77182