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SKY77182 Datasheet(PDF) 8 Page - Skyworks Solutions Inc. |
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SKY77182 Datasheet(HTML) 8 Page - Skyworks Solutions Inc. |
8 / 11 page DATA SHEET SKY77182 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA (1920–1980 MHz) Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 8 February 14, 2008 • Skyworks Proprietary and Confidential Information. • Products and product Information are subject to change without notice. • 200850A 0.6 0.6 0.4 0.2 0.7 1.1 3 3.2 1.4 0.7 0.5 0.4 1.1 3 3.2 2.1 STENCIL APERTURE TOP VIEW APPROACH 1 0.25 0.8 TYP 3 3.2 0.4 STENCIL APERTURE TOP VIEW APPROACH 2 METALLIZATION TOP VIEW 2.65 3 3.3 0.8 TYP 0.8 TYP 0.8 TYP Thermal Via Array Ø0.3 mm on 0.5 mm Pitch Additional vias will improve thermal performance. NOTE: Thermal Vias should be tented and filled with solder mask 30–35 μm Cu plating recommended SOLDER MASK OPENING TOP VIEW 0.6 200565_005 ALL DIMENSIONS IN MILLIMETERS Common Ground Pad Component Outline Component Outline Component Outline Component Outline Figure 5. Phone PCB Layout Footprint for 3 x 3 x 0.9 mm, 8-pad Package – SKY77182 |
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