PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

RC4558D

ACTIVE

SOIC

D

8

75

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

RC4558DGKR

ACTIVE

MSOP

DGK

8

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1YEAR

RC4558DR

ACTIVE

SOIC

D

8

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

RC4558ID

ACTIVE

SOIC

D

8

75

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

RC4558IDGKR

ACTIVE

MSOP

DGK

8

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1YEAR

RC4558IDR

ACTIVE

SOIC

D

8

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

RC4558IP

ACTIVE

PDIP

P

8

50

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

RC4558IPW

ACTIVE

TSSOP

PW

8

150

Pb-Free

(RoHS)

CU NIPDAU

Level-1-250C-UNLIM

RC4558IPWR

ACTIVE

TSSOP

PW

8

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-1-250C-UNLIM

RC4558P

ACTIVE

PDIP

P

8

50

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

RC4558PSLE

OBSOLETE

SO

PS

8

None

Call TI

Call TI

RC4558PSR

ACTIVE

SO

PS

8

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

RC4558PW

ACTIVE

TSSOP

PW

8

150

Pb-Free

(RoHS)

CU NIPDAU

Level-1-250C-UNLIM

RC4558PWLE

OBSOLETE

TSSOP

PW

8

None

Call TI

Call TI

RC4558PWR

ACTIVE

TSSOP

PW

8

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-1-250C-UNLIM

RC4558Y

OBSOLETE

XCEPT

Y

0

None

Call TI

Call TI

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

PACKAGE OPTION ADDENDUM

www.ti.com

18-Feb-2005

Addendum-Page 1