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MAX3221DB Datasheet(PDF) 1 Page - Texas Instruments |
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MAX3221DB Datasheet(HTML) 1 Page - Texas Instruments |
1 / 15 page MAX3221 3V TO 5.5V SINGLECHANNEL RS232 LINE DRIVER/RECEIVER WITH ±15kV ESD PROTECTION SLLS348M − JUNE 1999 − REVISED MARCH 2004 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D RS-232 Bus-Pin ESD Protection Exceeds ±15 kV Using Human-Body Model (HBM) D Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards D Operates With 3-V to 5.5-V VCC Supply D Operates Up To 250 kbit/s D One Driver and One Receiver D Low Standby Current...1 µA Typical D External Capacitors ...4 × 0.1 µF D Accepts 5-V Logic Input With 3.3-V Supply D Alternative High-Speed Pin-Compatible Device (1 Mbit/s) − SNx5C3221 D Auto-Powerdown Feature Automatically Disables Drivers for Power Savings D Applications − Battery-Powered, Hand-Held, and Portable Equipment − PDAs and Palmtop PCs − Notebooks, Subnotebooks, and Laptops − Digital Cameras − Mobile Phones and Wireless Devices description/ordering information The MAX3221 consists of one line driver, one line receiver, and a dual charge-pump circuit with ±15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. These devices operate at data signaling rates up to 250 kbit/s and a maximum of 30-V/ µs driver output slew rate. ORDERING INFORMATION TA PACKAGE† ORDERABLE PART NUMBER TOP-SIDE MARKING SSOP (DB) Tube of 80 MAX3221CDB MA3221C −0 °C to 70°C SSOP (DB) Reel of 2000 MAX3221CDBR MA3221C −0 °C to 70°C TSSOP (PW) Tube of 90 MAX3221CPW MA3221C TSSOP (PW) Reel of 2000 MAX3221CPWR MA3221C SSOP (DB) Tube of 80 MAX3221IDB MB3221I −40 °C to 85°C SSOP (DB) Reel of 2000 MAX3221IDBR MB3221I −40 °C to 85°C TSSOP (PW) Tube of 90 MAX3221IPW MB3221I TSSOP (PW) Reel of 2000 MAX3221IPWR MB3221I † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Copyright 2004, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. DB OR PW PACKAGE (TOP VIEW) 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 EN C1+ V+ C1− C2+ C2− V− RIN FORCEOFF VCC GND DOUT FORCEON DIN INVALID ROUT |
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