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DLL-100R-2.14G Datasheet(PDF) 1 Page - Merrimac Industries, Inc. |
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DLL-100R-2.14G Datasheet(HTML) 1 Page - Merrimac Industries, Inc. |
1 / 2 page FREQUENCY RANGE MHz MEAN DELAY* (nS) PHASE DEVIATION (DEGREES MAX) AMPLITUDE FLATNESS (dB p-p) 2110 - 2170 10.0 ± 0.2 ± 1.0 0.1 RETURN LOSS (dB MIN) INSERTION LOSS (dB MAX) POWER HANDLING (WATTS) RF INTERFACE SIZE/OUTLINE (Inches - l,w,h) 20 5.8 45 Surface Mount 1.0 x 1.0 x 0.045 Specifications are based upon unit mounted on printed circuit board with 50 Ohm nominal impedance. *Mean delay refers to the group delay of the applied input signal through the network. The specified tolerance relates to unit-unit group delay variation. MULTI-MIX DELAY LINES FEATURES APPLICATIONS • 2110 - 2170 MHz • WCDMA • LOW LOSS • UMTS • LOW VSWR • BASESTATION POWER AMPLIFIER • SURFACE MOUNT LINEARIZATION NETWORKS • LOW COST • FEED FORWARD • PRE-DISTORTION • ADAPTIVE INTERFERENCE CANCELLATION The DLL-100R-2.14G, a member of the Multi-Mix ® DLL family of delay lines, provides a mean delay of 10.0 nS in the UMTS band and features low insertion loss and low VSWR. The DLL-100R-2.14G exhibits excellent phase linearity and amplitude flatness over the 2110 - 2170 MHz frequency range. The Multi- Mix DLL-100R-2.14G is intended for use in power amplifier linearization networks such as feedforward and predistortion. DLL delay lines are fusion bonded multilayer stripline structures. The DLL series offers an excellent alter- native to expensive coaxial and delay filter structures. The fusion bonding process yields a homgeneous monolithic dielectric structure with reliability, ruggedness and electrical and thermal performance that is superior to conventional adhesive bonding techniques. DELAY LINE DLL-100R-2.14G TECHNICAL DESCRIPTION PRELIMINARY REV: 001, 06/14/05 THE MULTI-MIX MICROTECHNOLOGY ® GROUP IS ISO 9001:2000 REGISTERED Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006 Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: crm@merrimacind.com / www.merrimacind.com U.S. Patent 6,099,677 and other Patents Pending. GENERAL SPECIFICATIONS PACKAGE OUTLINE 1.000 [25.40] 0.087 [2.21] 0.848 [21.54] HOT VIA HOT VIA GND GND ORIENTATION MARKER DENOTES PIN LOCATION PIN 1 PIN 2 12 |
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