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LTC4068-4.2 Datasheet(PDF) 5 Page - Linear Technology |
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LTC4068-4.2 Datasheet(HTML) 5 Page - Linear Technology |
5 / 12 page 5 LTC4068-4.2/LTC4068X-4.2 406842fa TYPICAL PERFOR A CE CHARACTERISTICS Charge Current vs Supply Voltage Charge Current vs Ambient Temperature Recharge Threshold Voltage vs Temperature Power FET “ON” Resistance vs Temperature VCC (V) 4 0 100 200 300 400 600 4.5 5 5.5 6 405842 G13 6.5 7 500 VBAT = 4V TA = 25°C θJA = 40°C/W RPROG = 2k RPROG = 10k TEMPERATURE (°C) –50 400 500 600 25 75 405842 G14 300 200 –25 0 50 100 125 100 0 VCC = 5V VBAT = 4V θJA = 40°C/W RPROG = 2k ONSET OF THERMAL REGULATION RPROG = 10k TEMPERATURE (°C) –50 4.04 4.06 4.08 4.10 4.12 4.16 –25 025 50 405842 G15 75 100 4.14 VCC = 5V RPROG = 10k TEMPERATURE (°C) –50 700 650 600 550 500 450 400 350 –25 025 50 405842 G17 75 125 100 VCC = 4.2V IBAT = 100mA RPROG = 2k PI FU CTIO S ITERM (Pin 1): Charge Termination Program. The charge termination current threshold current is programmed by connecting a 1% resistor, RTERM, to ground. The current threshold ITERM, is set by the following formula: I V R R V I TERM TERM TERM TERM == 100 100 , BAT (Pin 2): Charge Current Output. Provides charge current to the battery from the internal P-channel MOSFET, and regulates the final float voltage to 4.2V. An internal precision resistor divider from this pin sets the float voltage. This divider is disconnected in shutdown mode to minimize current drain from the battery. CHRG (Pin 3): Charge Status Open-Drain Output. When the battery is charging, the CHRG pin is pulled low by an internal N-channel MOSFET. When the charge cycle is completed, CHRG becomes high impedance. GND (Pins 4, 9): Ground/Exposed Pad. The exposed backside package pad (Pin 9) is electrical ground and must be soldered to the PC board for maximum heat transfer. |
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