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LTC3824EMSE-TR Datasheet(PDF) 10 Page - Linear Technology |
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LTC3824EMSE-TR Datasheet(HTML) 10 Page - Linear Technology |
10 / 12 page LTC3824 10 3824fc APPLICATIONS INFORMATION 2. Power MOSFET switching and condution losses: P MOSFET = V OUT + VD V IN + VD (I OUT ) 2(1+δ)R DS(ON) + K(V IN ) 2(I OUT )(CRSS )(f) 3. The I2R losses of the current sense resistor: P(SENSE R) = (IOUT)2 • R • D where D is the duty cycle 4. The inductor loss due to winding resistance: P(WINDING) = (IOUT)2 • RW 5. Loss of the catch diode: P(DIODE) = IOUT • VD • (1–D) 6. Other losses, including CIN and COUT ESR dissipation and inductor core losses, generally account for less than 2% of total losses. PCB Layout Considerations To achieve best performance from a LTC3824 circuit, the PC board layout must be carefully designed. For lower power applications, a 2-layer PC board is sufficient. However, at higher power levels, a multiple layer PC board is recom- mended. Using a solid ground plane under the circuit is the easiest way to ensure that switching noise does not affect the operation. In order to help dissipate the power from the MOSFET and diode, keep the ground plane on the layers closest to the layers where power components are mounted. Use power planes for the MOSFET and diode in order to improve the spreading of heat from these components into the PCB. For best electrical performance the LTC3824 circuit should be laid out as following: Place all power components in a tight area. This will minimize the size of high current loops. Orient the input and output capacitors and current sense resistor in a way that minimizes the distance between the pads connected to ground plane. Place the LTC3824 and associated components tightly to- gether and next to the section with power components. Use a local via to ground plane for all pads that connect to ground. Use multiple vias for power components. Connect the current sense input directly to the current sense resistor pad. VCC and SENSE are the inputs of the internal current sense amplifier and should be connected as close to the sense resistor pads as possible. A 100pF capacitor is required across the VCC and sense pins for noise filtering and should be placed as close to the pins as possible. Design Example As an example, the LTC3824 is designed for an automotive 5V power supply with the following specifications: Maximum IOUT = 2A, typical VIN = 6V to 18V and can reach 60V briefly during load dump condition, and operating switching frequency = 400kHz. For f = 400kHz, RSET is chosen to be 180k. Allow inductor ripple current to be 0.8A (40% of the maximum output current) at VIN = 18V, L = (18V – 5V)5V (400kHz • 0.8A)18V = 12μH COUT will be selected based on the ESR that is required to satisfy the output voltage ripple requirement and the bulk capacitance needed for loop stability. For this design a 220μF tantalum capacitor is used. For worse-case conditions CIN should be rated for at least 1A ripple current (half of the maximum output current). A 47μF tantalum capacitor is adequate. A current limit of 3.3A is selected and RSENSE can be calculated by : RSENSE = 100mV 3.3A = 0.03 and a 25mΩ resistor can be used. |
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